Microelectronics Solder Assembler

About the role

Assemble high-reliability RF microelectronic modules for defense electronics manufacturing.

Responsibilities

• Assemble high-reliability RF microelectronic modules using SMT technology.
• Operate equipment such as soldering irons, hot plates, vacuum ovens, and reflow tools.
• Rework small components like 0201s, QFNs, and packaged parts with tight pitches.
• Perform soldering, component stripping, tinning, crimping, and post-solder cleaning to ensure quality.
• Interpret engineering drawings and assembly instructions while adhering to ESD, cleanroom, and workmanship standards (e.g., J-STD-001 Class 3).
• Learn advanced BGA reflow equipment and collaborate with engineers to troubleshoot and improve processes.
• Perform die attach operations and inspect assemblies under high magnification to ensure compliance with military specifications.

Requirements

• High school diploma or equivalent.
• At least 7 years of microelectronics assembly experience in defense or aerospace settings.
• Strong manual dexterity and knowledge of military/aerospace standards (MIL-STD-883, J-STD-001, IPC-A-610).
• Experience working in cleanroom environments.

Qualifications

• Certifications in IPC J-STD-001 and MIL-STD-883 preferred.

Skills & Attributes

• Self-motivated and reliable.
• Able to work independently and follow detailed instructions.
• Effective communication skills.
• Ability to collaborate with engineers, train others, and contribute to process improvements.

Work Environment

Production floor within a manufacturing facility.