Microelectronics Solder Assembler

Job Summary

We are seeking a highly skilled Senior Microelectronics Assembler to join our defense electronics manufacturing team. In this critical role, you will assemble high-reliability RF microelectronic modules using solder mount technology (SMT).

Key Responsibilities

• Operate SMT microelectronics equipment: soldering irons, hot plates, vacuum ovens, reflow tools.
• Ability to rework components as small as 0201 and various sizes of QFNs and packaged parts with tight pitch.
• Comfort using flux and experience and emphasis on post-solder cleaning SMT boards for high quality.
• Ability to solder connectors, strip leads, tin components and crimp harnesses.
• Interpret and work from detailed engineering and production drawings, process travelers, and assembly instructions.
• Maintain strict adherence to ESD controls, cleanroom protocols, and workmanship standards (e.g., J-STD-001 Class 3).
• Ability to learn advanced BGA solder reflow equipment.

Required Qualifications

• High school diploma or equivalent; technical certificate or associate degree preferred.
• Minimum 7 years of hands-on experience in microelectronics assembly, specifically in defense or aerospace environments.
• Excellent hand-eye coordination and manual dexterity for high-precision work under a microscope, and use of fine motor skills for assembly tasks requiring microscopes and tweezers.
• Knowledge and understanding of military and aerospace standards (MIL-STD-883, J-STD-001 Class 3, IPC-A-610/STD-001).
• Experience working in Class 1000 or Class 10,000 cleanroom environments.
• Certification in IPC J-STD-001 and/or MIL-STD-883 procedures.

Preferred Qualifications

• Self-motivated, reliable, and able to work independently in a fast-paced, secure environment.
• U.S. Citizenship to handle ITAR documents
• Strong communication skills and ability to follow detailed instructions and process documentation.
• Able to work with engineers to aid in early development prototyping and contribute to process improvement initiatives.
• Leadership ability to train and work with other assemblers
• Conduct die attach operations using conductive and non-conductive epoxies or eutectic methods or ability to learn attach methods.
• Collaborate with quality engineers and process engineers to troubleshoot issues and improve yields, as well as RF and hardware engineers on early development modules to meet customer needs.
• Perform precision assembly of high-reliability microelectronic packages, including hybrid modules & IMA, MCMs, RF SMT boards and chip-and-wire assemblies.
• Inspect in-process and final assemblies under high magnification to ensure compliance with military specifications (e.g., MIL-PRF-38534, MIL-STD-883).

Work Environment

Production Floor in a Manufacturing Facility.

Pay

$30.00-$40.00/hr.