Lead Account Manager - Data Centers

Responsibilities

• Own full commercial responsibility for assigned Datacenter accounts (e.g., hyperscalers, AI platform companies, ecosystem partners)
• Drive revenue growth, pipeline development, and long-term supply agreements
• Lead pricing, negotiations, and commercial strategy aligned with TAS growth objectives
• Expand share of wallet across TIMs, heat spreaders, and advanced packaging solutions
• Act as the Sales lead in the triad (Sales–BD–R&D/TS) with joint accountability for customer success
• Coordinate tightly with: BD: early engagement, roadmap shaping, and architecture influence
• TS/R&D: technical credibility, qualification, and issue resolution
• Ensure alignment on: Account priorities and growth roadmap
• Program milestones and design-in strategy
• Resource allocation and escalation
• Serve as the single commercial coordinator ensuring internal alignment and external clarity
• Build executive-level and working-level relationships across engineering, procurement, and operations
• Lead: Quarterly business reviews (QBRs), Commercial discussions and contract negotiations, Cross-functional workshops with customers
• Drive early engagement with customers to influence specifications before design freeze
• Improve: Design win rates, pipeline conversion and time-to-qualification
• Focus on solution selling, not product selling, particularly in advanced packaging and thermal management for AI/datacenters
• Lead internal coordination across: Technical Service / Application Engineering, R&D / Product Development, Supply chain, quality, and operations
• Remove execution barriers and drive: Program milestone delivery, Customer commitments, Issue resolution
• Translate customer requirements into actionable internal plans

Qualifications

• 8–12+ years in semiconductor materials, advanced packaging, or thermal management
• Proven experience managing strategic accounts in Datacenter / AI ecosystem
• Strong track record in: Complex solution selling, Cross-functional leadership in matrix environments, Driving design wins and long qualification cycles
• Understanding of: Datacenter architectures and AI compute platforms, Advanced packaging (2.5D/3D, chiplets, HBM), Thermal management challenges in high-power systems
• Ability to connect: System-level challenges → material/process solutions
• Strong influencing skills without direct authority
• Ability to operate at both: Strategic (account roadmap, partnerships) Tactical (pipeline, execution cadence)
• Excellent communication across: Technical Teams and Executive Stakeholders