WATD Module Development Engineer

About the role

Join the Wafer Assembly Technology Development Group (WATD) at Intel. As a Module Development Engineer, you will drive innovation and excellence in Intel's advanced semiconductor packaging technology development.

Responsibilities

• Drive technology development and enablement for both high-volume manufacturing and future technologies.
• Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
• Perform feasibility studies and pathfinding activities to meet desired device specifications through simulations and practical engineering methods.
• Develop and implement technology roadmaps to guide future manufacturing needs and industry standards.
• Collaborate with equipment and material suppliers to design and implement enabling process technologies.
• Recommend and execute modifications to operational equipment to improve efficiency, scalability, and production output.
• Employ statistical process control, data analytics, and machine learning techniques to enhance process stability and enable continuous improvement.
• Optimize production efficiency, manufacturing techniques, and output for existing and new products.
• Partner with cross-functional teams to ensure process integration and alignment with project deliverables.

Qualifications

• Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 6+ years of relevant experience.
• OR Master's degree in the same fields with 4+ years of experience.
• OR PhD in the same fields with 2+ years of experience.
• Experience listed above should be a combination of the following: Development methodologies, statistical process control, and/or data analytics.
• Wafer-level assembly, semiconductor equipment developing/processing, or advanced packaging technology development.