Packaging Module Development Engineer

About the role

Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role, you will shape the future of advanced IC packaging solutions by driving process and equipment innovations critical to Intel's roadmap for assembly packaging platform technologies.

Key Responsibilities

• Develop and optimize advanced packaging processes and equipment to support Intel's Glass Core and CPO roadmap.
• Define and implement process specifications, equipment configurations, and workflows for new technologies, ensuring seamless integration into manufacturing.
• Apply design of experiments (DOE) principles to characterize process windows and understand the interactions between equipment, materials, and processes.
• Drive continuous improvements in process capability, quality, reliability, cost, yield, automation, and productivity.
• Develop and maintain equipment for testing silicon and package technologies under simulated field conditions, including thermal, humidity, and mechanical stress environments.
• Collaborate with supplier quality and procurement teams to ensure material specifications and vendor performance meet strict quality standards.
• Lead efforts to develop innovative techniques, tools, and methods to accelerate technology readiness and identify risks early in the development cycle.
• Document advancements through white papers, technical reports, and data analysis.
• Partner with cross-functional engineering teams and external stakeholders to address packaging challenges and align solutions with Intel's strategic goals.

Qualifications

• Bachelor's or MS degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a related technical field.
• +4 years of experience in: Process development, equipment adjustment, and manufacturing process control.
• Design of experiments (DOE) principles and statistical data analysis.
• Process characterization and statistical process control methodologies.
• Material testing and characterization techniques such as DSC, TGA, D/TMA, ICPMS, FTIR, or SEM.

Preferred Qualifications

• Master's degree with 3 or more years, or PhD degree with 0 years of experience in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related technical field.
• Analytical skills and experience troubleshooting integrated technology challenges.
• Advanced statistical tools, process control frameworks, and Microsoft Office software suite applications.
• Experience working with both organic and inorganic materials in packaging processes.
• 1 year of Photolithography experience.

Pay

Annual Salary Range for jobs which could be performed in the US: $133,800.00 - 188,890.00 USD

Schedule

Shift 1 (United States of America)

Location

Primary Location: US, Arizona, Phoenix