Packaging Module Equipment Development Engineer

Job Details

About the role

Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment and applies innovative engineering concepts to support Intel’s future assembly packaging platform technologies. Optimizes manufacturing processes to improve quality, reliability, cost, yield, productivity, and manufacturability. Develops process and equipment specifications using Design of Experiments (DOE), Statistical Process Control (SPC), and data analysis methodologies to drive process optimization and continuous improvement. Documents technical findings, process improvements, and best practices through technical reports and white papers. Develops and maintains equipment used to evaluate silicon and package technologies under simulated field-use conditions, including heat, humidity, temperature cycling, and dynamic force environments. Ensures manufacturability of package designs and supports manufacturing process flows, procedures, and implementation activities. Collaborates with cross-functional engineering, manufacturing, supplier quality, and procurement teams to establish material specifications and ensure vendor performance and material quality standards are achieved. Supports innovation efforts focused on process reliability, manufacturing quality, and equipment efficiency. Leads technical problem-solving and process improvement initiatives using experimental design and statistical analysis methods. Provides technical consultation related to packaging and manufacturing process improvements and responds to customer or stakeholder needs as required. Partners with packaging technology development and engineering teams to drive process standardization, manufacturing quality improvements, and technology readiness aligned to product milestones and key risk areas.

Responsibilities

• Develops assembly processes and/or equipment and applies innovative engineering concepts to support Intel’s future assembly packaging platform technologies.
• Optimizes manufacturing processes to improve quality, reliability, cost, yield, productivity, and manufacturability.
• Develops process and equipment specifications using Design of Experiments (DOE), Statistical Process Control (SPC), and data analysis methodologies to drive process optimization and continuous improvement.
• Documents technical findings, process improvements, and best practices through technical reports and white papers.
• Develops and maintains equipment used to evaluate silicon and package technologies under simulated field-use conditions, including heat, humidity, temperature cycling, and dynamic force environments.
• Ensures manufacturability of package designs and supports manufacturing process flows, procedures, and implementation activities.
• Collaborates with cross-functional engineering, manufacturing, supplier quality, and procurement teams to establish material specifications and ensure vendor performance and material quality standards are achieved.
• Supports innovation efforts focused on process reliability, manufacturing quality, and equipment efficiency.
• Leads technical problem-solving and process improvement initiatives using experimental design and statistical analysis methods.
• Provides technical consultation related to packaging and manufacturing process improvements and responds to customer or stakeholder needs as required.
• Promotes process standardization, manufacturing quality improvements, and technology readiness aligned to product milestones and key risk areas.

Qualifications

• Bachelor’s degree in Engineering, Physics, Chemistry, Materials Science, or a related technical field with 5+ years of engineering industry experience including inspection equipment; OR
• Master’s degree in a related field with 3+ years of engineering industry experience; OR
• PhD in a related field with 6+ months of engineering industry experience.

Preferred Qualifications

• Experience with automated inspection tools, image processing algorithms and artificial intelligence.
• Semiconductor fabrication processes and technology experience.
• Advanced packaging and/or assembly process experience.
• Experience with equipment selection, integration, ownership, and change control management systems.
• Project management experience delivering results for complex, time-critical technical projects.
• Strong technical problem-solving and innovation skills within manufacturing or engineering environments.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Annual Salary Range

$133,800.00 - 188,890.00 USD

Work Model

This role will require an on-site presence.