Module Development Engineer

About the role

Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.

Responsibilities

• Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
• Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmap.
• Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.
• PARTNERS WITH KEY EQUIPMENT AND MATERIALS SUPPLIERS TO DEVELOP AND IMPLEMENT ENABLING ELEMENTS OF THE TECHNOLOGY.
• Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods.
• Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.

Qualifications

• Minimum qualifications: PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of relevant experience OR Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of relevant experience OR Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 9+ years of relevant experience.
• Relevant recent experience includes, but is not limited to: Hands-on experience in dry etch semiconductor manufacturing, including ownership of complex process development and optimization in a foundry or high volume manufacturing environment; Strong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms; Demonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodes; Proven ability to lead technical problem solving across projects or sub modules, influencing peers and stakeholders without formal people management responsibility; Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data based decisions; Experience working with and troubleshooting advanced semiconductor manufacturing equipment in a cleanroom environment.

Preferred Qualifications

• 5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies, including technology node transitions or major process changes;
• Experience with advanced dry etch technologies such as: ICP / CCP plasma etch, High aspect ratio etch (HARC), Atomic Layer Etch (ALE), Radical and Vapor phase isotropic etching, Ash and surface treatments, EUV patterned layer etch integration;
• Demonstrated impact on cross module or integration level challenges, such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion;
• Strong understanding of advanced device architectures (e.g., FinFET, GAA, nanosheet) and their etch integration requirements;
• Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation;
• Expertise defining technical approaches, de-risking options, and guiding less senior engineers through complex problem solving;
• Evidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organization.

Pay

$155,520.00 - 298,440.00 USD

Schedule

Shift 1 (United States of America)

Location

US, Oregon, Hillsboro

Additional Locations

• US, Arizona, Phoenix
• US, California, Santa Clara