Jobs · Engineering · Texas

Sr. IC Package Design Engineer (Silicon Engineering)

SpaceX · Austin, TX · 1 mo ago
On-siteEngineeringFull-time

About the role

We are seeking a motivated, proactive, and intellectually curious Sr. IC Package Design Engineer to work alongside world-class cross-disciplinary teams (systems, firmware, architecture, design, validation, product engineering, ASIC implementation). In this role, you will develop cutting-edge next-generation ASICs for deployment in space and ground infrastructures globally. These chips enable connectivity in places where it has previously not been available, affordable, or reliable. As an integral part of the IC design team, you will lead packaging for custom in-house ASICs and RFICs for digital beam formers and modems.

Responsibilities

  • Own and drive advanced package selection, new product BGA configuration, and package structure.
  • Responsible for package/SiP layout, optimization, design verification, and tapeout.
  • Interface and coordinate with cross-functional groups throughout SpaceX on new product package selection, feasibility analysis, and design.
  • Work cross-functionally, understand trade-offs and constraints, and optimize silicon floor plan, bump, and package pinout.
  • Simulate and optimize signal/power integrity and RF performance of the package design.
  • Drive methodology, innovations, and productivity improvements in package design.

Qualifications

  • Bachelor's degree in electrical engineering, computer engineering, or physics.
  • 5+ years of experience with IC package design.

Skills

  • Experience with Co-packaged Optics (CPO).
  • Thorough understanding of signal and power integrity fundamentals.
  • Substrate design experience for RF, digital, high-speed, and mixed-signal die.
  • Experience with Cadence APD+/SiP or similar design tools.
  • Experience in package design electrical review, SI/PI analysis.
  • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, ADS.
  • Experience in package design for manufacturing reviews.
  • Familiar with BGA package substrate technologies.
  • Strong problem-solving skills with strong engineering fundamentals.

Additional Requirements

  • Ability to work extended hours or weekends as needed to meet mission-critical deadlines.

To conform to U.S. Government export regulations, the applicant must be a U.S. citizen or national, U.S. lawful permanent resident (green card holder), Refugee under 8 U.S.C. §1157, or Asylee under 8 U.S.C. §1158, or be eligible to obtain the required authorizations from the U.S. Department of State.

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