IC Package Design Engineer

Responsibilities

• Lead the physical layout of complex multi-die substrates while supporting chiplet-based integration.
• Collaborate with package integration, signal/power integrity, and mechanical teams to ensure successful layout implementation.
• Drive routing feasibility and co-design alignment with floor planning, mechanical, and system constraints.
• Own the full layout process, ensuring performance, manufacturability, and design quality.
• Use industry-standard tools like Siemens Xpedition and Cadence Allegro APD to execute and refine substrate designs.

Qualifications

• 8+ years of experience in substrate layout design for advanced packaging.
• Must be eligible to work in the United States and obtain and maintain an Active U.S. Government Secret Clearance.
• Strong background in physical layout and collaboration with ASIC, signal, and power teams.
• Proficient in Siemens Xpedition and Cadence Allegro APD.
• Bachelor’s degree in Electrical Engineering preferred.

Pay

Salary Range: $200,000 – $260,000 annually

Benefits

• Comprehensive Benefits: Medical, Dental, Vision, 401K, PTO, Sick Leave (if required by law), and Holidays