IC Packaging Design Engineer

Role Overview

We are seeking an IC Packaging Design Engineer with experience in advanced semiconductor package design and substrate layout. The role involves package implementation using Siemens Xpedition or Cadence APD while ensuring signal integrity, power integrity, manufacturability, and design rule compliance.

Key Responsibilities

• Develop IC package layouts for advanced semiconductor devices.
• Create substrate designs using Siemens Xpedition (XPD) or Cadence APD.
• Implement package physical design following engineering specifications.
• Collaborate with SI/PI teams during package implementation.
• Perform substrate routing, fanout planning, and escape routing.
• Ensure compliance with package design rules and manufacturing requirements.
• Support design reviews and engineering change implementation.
• Capture coordination with hardware, PCB, and package engineers.
• Optimize package layout for electrical and mechanical performance.
• Support package release documentation.
• Contribute to yield and reliability improvements.

Required Qualifications

• Bachelor's or Master's degree in Electrical or Electronics Engineering.
• 4-6 years of experience in IC Packaging Design.
• Experience in advanced semiconductor package layout.
• Strong understanding of substrate design methodologies.
• Experience working in cross-functional semiconductor teams.

Technical Skills

• Package Design Tools:
• Siemens Xpedition (Mentor Graphics XPD)
• Cadence Allegro
• Cadence Advanced Package Designer (APD)
• Cadence SiP
• Cadence APD
• IC Package Design
• Substrate Layout
• Package Routing
• Escape Routing
• Fanout Planning
• Physical Design
• Physical Layout
• Design Rule Check (DRC)
• Manufacturing Rules
• Package Stack-up
• Performance Optimization
• Signal Integrity (SI)
• Power Integrity (PI)
• Yield Optimization
• Reliability Design