Senior IC Packaging Development Engineer

About the role

We are looking for an experienced Engineer who will lead the development of rapid IC packaging of individual die, to enable Failure Analysis and NPI tasks ahead of high-volume manufacturing.

Responsibilities

• Drive the process, mechanical, thermal, and material evaluation of the latest IC packages.
• Manage rapid prototyping builds, package stack-ups, and assembly processes to bring new packaging architectures from concept to small volume for FA and NPI use cases.
• Pioneer new packaging & die-level processing methodologies and evaluate innovative packaging materials (e.g., molding compounds, substrates, adhesives).
• Collaborate with IC & Package design teams, process & product engineering, foundries, and OSAT (Outsourced Semiconductor Assembly and Test) partners to develop & test the required processes, tooling, and workflows.
• Coordinate comprehensive physical and electrical failure analysis on prototype builds, reliability-tested components to determine root causes of failures.

Requirements

• B.S., M.S., or Ph.D., or equivalent experience in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related semiconductor field.
• Deep understanding of flip-chip, 2.5D/3D packaging, wire bonding, and advanced substrate architectures.
• 12+ years of hands-on experience in IC packaging development and/or package design, NPI (New Product Introduction).
• Familiarity with IC package EDA software (e.g., Cadence Allegro Package Designer) and Finite Element Modeling (FEM) tools like ANSYS or ABAQUS is a strong plus.
• Basic understanding of advanced packaging related FA techniques and equipment, such as SEM, EDX, CSAM, X-Ray, and LIT.

Qualifications

• Experience: 12+ years of hands-on experience in IC packaging development and/or package design, NPI (New Product Introduction).

Skills

• Strong problem-solving skills.
• Excellent communication and collaboration abilities.
• Ability to work independently and as part of a team.

Benefits

Competitive salaries and a generous benefits package, including equity, are offered. Applications for this job will be accepted at least until July 19, 2026. This posting is for an existing vacancy.