Senior IC Packaging Development Engineer

What You Will Be Doing

• Drive the process, mechanical, thermal, and material evaluation of the latest IC packages.
• Manage rapid prototyping builds, package stack-ups, and assembly processes to bring new packaging architectures from concept to small volume for FA and NPI use cases.
• Pioneer new packaging & die-level processing methodologies and evaluate innovative packaging materials (e.g., molding compounds, substrates, adhesives).
• Collaborate with IC & Package design teams, process & product engineering, foundries, and OSAT partners to develop & test the required processes, tooling, and workflows.
• Coordinate comprehensive physical and electrical failure analysis on prototype builds, reliability-tested components to determine root causes of failures.

What We Need To See

• B.S., M.S., or Ph.D., or equivalent experience in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related semiconductor field.
• Deep understanding of flip-chip, 2.5D/3D packaging, wire bonding, and advanced substrate architectures.
• Experience: 12+ years of hands-on experience in IC packaging development and/or package design, NPI (New Product Introduction).
• Familiarity with IC package EDA software (e.g., Cadence Allegro Package Designer) and Finite Element Modeling (FEM) tools like ANSYS or ABAQUS is a strong plus.
• Basic understanding of advanced packaging related FA techniques and equipment, such as SEM, EDX, CSAM, X-Ray, and LIT.

Benefits

• Competitive salaries
• A generous benefits package

We are widely considered to be one of the technology world’s most desirable employers; we have some of the most forward-thinking and hardworking people in the world working for us and, due to unparalleled growth, best-in-class teams are rapidly growing.

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 168,000 USD - 270,250 USD for Level 5, and 216,000 USD - 345,000 USD for Level 6. You will also be eligible for equity and benefits.

Applications for this job will be accepted at least until July 19, 2026. This posting is for an existing vacancy.