Senior IC Packaging Designer

Responsibilities

• Design and develop RFIC packages and substrates optimized for high-frequency performance, including laminate, ceramic, or leadframe-based packages
• Create package layouts, bond diagrams, and substrate routing using semiconductor packaging EDA tools
• Work with signal integrity, EM, and thermal simulation teams to validate package performance
• Generate package documentation, fabrication drawings, and assembly specifications
• Participate in design reviews, prototype builds, and failure analysis to improve RF performance and yield
• Collaborate with RFIC designers to co-optimize chip and package performance, minimizing parasitics and signal loss
• Support package integration with PCB design teams to ensure optimal RF performance at the system level
• Collaborate with fabrication and assembly partners

Requirements

• Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline
• 3-5 years of experience designing advanced RFIC semiconductor packages up to 50GHz (e.g., wirebond, flip-chip, PoP, or SiP) using tools such as Cadence Allegro APD/SiP or Mentor Xpedition
• Strong foundation in electrical, thermal, materials, or mechanical engineering principles relevant to IC packaging
• Willingness to work full-time, onsite, in Atlanta, GA

Preferred Skills

• Familiarity with signal and power integrity analysis tools (e.g., HFSS, Q3D, PowerSI) and understanding of high-speed interface requirements such as DDR or PCIe
• Knowledge of substrate manufacturing processes, package layout constraints, and design verification tools including CAM350, Valor, or Calibre
• Experience with RFIC or 5G packaging design, along with scripting or automation skills (Python, TCL, Perl, or shell) to support design workflows
• Ability to build accurate 3-D models of packages using Ansys Electronics Desktop and EM-simulate them in HFSS and run thermal simulations on them with Icepak