Sr. IC Package Design Engineer (Silicon Engineering)

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars. We are seeking a motivated, proactive, and intellectually curious engineer who will work alongside world-class cross-disciplinary teams (systems, firmware, architecture, design, validation, product engineering, ASIC implementation) to develop cutting-edge next-generation ASICs for deployment in space and ground infrastructures globally. These chips enable connectivity in places it has previously not been available, affordable, or reliable.

About the role

As an IC Package Design Engineer, you will be an integral part of the IC design team and lead packaging for custom in-house ASICs and RFICs for digital beam formers and modems.

Responsibilities

• Own and drive advanced package selection, new product BGA configuration, and package structure
• Responsible for package/SIP layout, optimization, design verification, and tapeout
• Interface and coordinate with cross-functional groups throughout SpaceX on new product package selection, feasibility analysis, and design
• Work cross-functionally, understand trade-offs, constraints, and optimize silicon floor plan, bump, and package pin out
• Simulate and optimize signal/power integrity and RF performance of the package design
• Drive methodology, innovations, and productivity improvements in package design

Requirements

• Bachelor's degree in electrical engineering, computer engineering, or physics
• 5+ years of experience with IC package design
• Ability to work extended hours or weekends as needed to meet mission-critical deadlines
• To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C.1157, or (iv) Asylee under 8 U.S.C.1158, or be eligible to obtain the required authorizations from the U.S. Department of State.

Skills

• Experience with Co-packaged Optics (CPO)
• Thorough understanding of signal and power integrity fundamentals
• Substrate design experience for RF, digital, high-speed, and mixed-signal die
• Experience with Cadence APD+/SIP or similar design tools
• Experience in package design electrical review, SI/PI analysis
• Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, ADS
• Experience in package design for manufacturing reviews
• Familiar with BGA package substrate technologies
• Strong problem-solving skills with strong engineering fundamentals

Pay

Compensation range: $165,000 - $260,000 per year. Your actual level and base salary will be determined on a case-by-case basis and may vary based on job-related knowledge, skills, education, and experience. Base salary is just one part of your total rewards package at SpaceX.

Benefits

• Long-term incentives in the form of company stock, stock options, or long-term cash awards
• Potential discretionary bonuses and the ability to purchase additional stock at a discount through an Employee Stock Purchase Plan
• Comprehensive medical, vision, and dental coverage
• 401(k) retirement plan
• Short and long-term disability insurance
• Life insurance
• Paid parental leave
• Various discounts and perks
• 3 weeks of paid vacation and 10 or more paid holidays per year
• 5 days of sick leave per year (for exempt employees)