PRODUCT MANAGER, PACKAGING ASSEMBLY BUSINESS UNIT

Amkor is seeking a Product Manager for the Advanced Flip Chip Packaging Assembly Business Unit in Tempe, AZ. This role involves cross-functional management and direct customer interactions for new product development, qualification, and mass production of advanced flip chip products.

Responsibilities

• Apply detailed knowledge of semiconductor packaging assembly and substrate technologies across multiple concurrent development/NPI programs.
• Drive customer requirements and timelines to multiple Southeast Asia factories.
• Conduct root cause failure analysis and resolve obstacles related to product design, reliability, and manufacturability.
• Perform and analyze detailed cost modeling to provide product-level assembly pricing.
• Drive cost reductions and increased revenues within assigned customer base.
• Collaborate across functional groups, including engineering, product development, and associated product lines.
• Develop strong working relationships with equipment, material, and substrate suppliers.
• Work closely with suppliers and factory engineers to identify capabilities and capacities for key processes and material sets (e.g., ABF, uBall, stacked vias, Coreless, TIM/adhesives).
• Align on technology roadmaps and drive flip chip priorities for consumer, compute, mobile APs, and automotive products.
• Identify R&D gaps, such as transitioning from iPOP to alternatives in the mobile space.
• Participate in pricing and capacity expansion negotiations both internally and externally.
• Travel to customer sites and factories as needed (approximately 15% domestic and 15% international).

Requirements

• Bachelor’s Degree in a related Engineering field (Mechanical, Chemical, Materials, Electrical) with 10+ years of semiconductor industry experience, or a Master’s Degree in Engineering with 8+ years of relevant experience.
• Extremely organized technical project management experience, preferably involving offshore factories.
• Ability to multitask across numerous programs and teams in a heavily matrixed organization.
• Self-driven and motivated to adapt and overcome obstacles, assuming ownership of program success.
• Proactively identify potential risks before production to enable backup plans or alternative assembly strategies.
• Deep knowledge of semiconductor packaging design, materials, substrates, manufacturing methods, and flip chip package form factors.
• Excellent written and verbal communication skills.
• Frequent technical presentations to customers via face-to-face meetings and teleconferences.
• Proficiency with Microsoft Office (Excel, PowerPoint, Outlook).

Preferred Qualifications

• Hands-on manufacturing or technical experience on the manufacturing floor.
• PMP-certified project management.
• Experience with cost modeling, pricing, quoting activities, and products.
• Knowledge of material and package characterization data analysis, reliability test methods, and qualification procedures.
• Experience with flip chip packaging failure analysis methods.
• Familiarity with Design of Experiments and Statistical Process Control (JMP).
• Previous experience in an external customer-facing role.
• Public speaking experience (e.g., technical conferences).
• Experience with multiple advanced packaging technologies such as fcCSP, iPOP, HDFO, RDL, and 2.5D or other advanced options.

Schedule

This position has a hybrid schedule. Candidates must reside near the local Amkor office in Tempe, AZ, or be willing to relocate.