Principal Wafer Bonding Integration Engineer

Key Responsibilities

• Own wafer bonding integration strategy from early product development through high-volume manufacturing.
• Partner with design engineering, process development teams, and external foundries to develop robust manufacturing flows.
• Lead process transfer activities and ensure manufacturable, repeatable bonding solutions across multiple foundry partners.
• Serve as the primary technical interface between nEye engineering teams and external fabrication partners throughout NPI.
• Drive process readiness for new product introductions, ensuring schedule, yield, quality, and reliability objectives are achieved.
• Develop and optimize advanced wafer bonding processes including:Fusion Bonding Eutectic Bonding Hybrid Bonding Direct Wafer Bonding (Anodic bonding experience is beneficial but not required)
• Define bonding process windows, alignment strategies, thermal budgets, and material compatibility.
• Optimize surface preparation, cleaning, activation, CMP requirements, and post-bond processing.
• Develop integration strategies that balance bonding performance with downstream manufacturing requirements.
• Collaborate with packaging and process integration teams on bonded wafer architectures.
• Lead technical engagement with external foundries throughout process development and manufacturing.
• Support tape-outs, process qualifications, engineering builds, and production ramps.
• Review process data, SPC metrics, excursion reports, and corrective actions with foundry partners.
• Drive continuous improvements in yield, manufacturability, reliability, and cost.
• Coordinate engineering experiments and process characterization across multiple manufacturing partners.
• Analyze wafer-level metrology and inspection data to identify process limitations and failure mechanisms.
• Lead root cause investigations involving bonding defects such as:voids delamination alignment errors particle contamination bond strength failures
• Work closely with FA laboratories and foundries to implement corrective actions.
• Drive continuous yield improvement initiatives using statistical methods and structured problem-solving tools.

Required Experience

• BS, MS, or PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, MEMS, or a related technical discipline.
• 10+ years of experience in new product introduction with ownership in wafer process integration, advanced packaging, CMOS manufacturing.
• Hands-on and product development expertise with one or more advanced wafer bonding technologies, including:Fusion Bonding Eutectic Bonding Hybrid Bonding Direct Bonding
• Experience with TSV integration, wafer thinning, cavity SOI, or 3D integration technologies.
• Experience supporting products through NPI and manufacturing ramp.
• Strong understanding of wafer-level process integration and manufacturing interactions.
• Experience working directly with semiconductor foundries or external manufacturing partners.
• Strong understanding of SPC, DOE, process characterization, yield improvement, and statistical analysis.

Preferred Experience

• Experience in MEMS, silicon photonics, advanced packaging, or heterogeneous integration.
• TSE experience supporting semiconductor customers or foundries.
• Familiarity with wafer-level metrology techniques including SEM, IR inspection, profilometry, C-SAM, AFM, or similar analytical tools.
• Experience leading cross-functional engineering efforts between design, manufacturing, and suppliers.
• Working knowledge of 8D, FMEA, Six Sigma, and structured root cause methodologies.
• Comfortable operating in a fast-paced startup environment where engineers have broad technical ownership.