CVD Process Engineer - Wafer Bonding

Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow.

About the role

Samsung Austin Semiconductor is seeking an experienced engineer to deliver technical leadership in wafer bonding and de-bonding. The primary duties include designing and executing process experiments, analyzing bonding quality and reliability, troubleshooting process issues, and collaborating with cross-functional teams to improve bonding techniques. This role must ensure compliance with industry standards, maintain detailed documentation of process parameters and results, and ensure smooth 24/7 wafer bonding operation.

Responsibilities

• Prepare and calibrate bonding and de-bonding equipment according to manufacturer specifications and process requirements
• Ensure tool-to-tool matching across fabs and between tools
• Develop and maintain Preventative Maintenance schedules and procedures
• Ensure bonding meets device and process output specifications
• Successfully transfer and qualify process from development fab to HVM facility
• Investigate wafer bonding issues, create troubleshooting plans, and apply corrective action plans
• Provide clear updates and instructions to users and management regarding ongoing issues and resolutions
• Maintain FMEA and manage RPN reduction activity
• Lead development and design experiments to carry out improvements in bonding yield, reliability, cost, and throughput
• Collaborate with vendors in evaluation and qualification of new bonding and de-bonding techniques
• Provide technical support and training to operators and technicians on equipment operation and procedures
• Present key technical developments to SAS technical staff and management

Requirements

• Bachelor’s degree in Engineering or a related technical discipline
• Minimum of 5 years of engineering experience in Fab Equipment management
• Minimum of 3 years of experience in wafer bonding and de-bonding equipment
• Experience in the semiconductor environment or in high-volume advanced manufacturing
• Desire to take on technical challenges and shifting priorities in a fast-paced, cutting-edge environment
• Able to work with others in a team-oriented culture
• Experience with data analysis: able to quickly analyze, summarize, and present data in an easy-to-understand format
• Experience with project management and project prioritization; ability to define milestones, work in parallel on multiple projects, and balance long-term projects with daily sustaining
• Ability to rapidly come up to speed with new computer applications and systems
• Able to work for several hours per day in a cleanroom environment

Skills

• Required: Knowledge and familiarity with hybrid bonding techniques and equipment
• Desired: Knowledge and familiarity with semiconductor equipment: vacuum systems, RF systems, plasma, MFCs, pneumatic valves, recipes, safety considerations & protocols, schematics, maintenance scheduling, etc.
• Desired: Ability to manipulate and interpret equipment sensor data for advanced equipment troubleshooting and setting up controls for equipment sensors
• Desired: VBA, Python, R, SQL, or other basic programming

Pay

The current base salary range for this role is between $70,480 and $179,090. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications, and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors including organizational and individual performance.

Benefits

• Medical, dental, and vision insurance
• Life insurance and 401(k) matching with immediate vesting
• Onsite café(s) and workout facilities
• Paid maternity and paternity leave
• Paid time off (PTO) + 2 personal holidays and 10 regular holidays
• Wellness incentives
• MBO bonuses based on company, division, and individual performance (eligible for full-time employees)

Schedule

All positions at Samsung Austin Semiconductor are full-time on-site.