Wafer Process Engineer

About the role

Forge Nano Inc., a rapidly growing advanced materials company specializing in nano-scale coatings across diverse markets, is seeking a Wafer Process Engineer to develop and sustain our atomic layer deposition (ALD) TEPHRA cluster tool. This role performs customer demonstrations, process development, and data analysis while working closely with technicians, the hardware engineering group, and scientists to ensure tool projects are executed and the lab operates smoothly.

Responsibilities

• Execute thin film coating tool demonstrations on wafers using ALD on the TEPHRA cluster platform, including assessing experiment plans, generating design of experiments, data analysis, and execution with meticulous documentation.
• Collaborate with scientists, other process engineers, and technicians to perform experimental planning, execution, and reporting tasks.
• Perform hands-on work on-tool for process optimization, continuous improvement projects, process transfer, and new process development.
• Interpret thin film metrology data (ellipsometry and surface defects/particles) and evaluate the success of experiments, recommending next steps based on findings.
• Maintain neat and orderly records of all work, including data and documentation to support patent applications for innovative products.
• Assemble and maintain vacuum systems and thin film equipment, including tasks related to materials production, equipment testing, and maintenance.
• Evaluate new hardware performance on-tool compared to the component of record and provide assessments to the Hardware Engineering group.
• Create, edit, and maintain documentation for procedures, processes, and best-known methods, including work instructions, standard operating procedures, and process documentation & recipes.
• Maintain a safe work environment, ensuring OSHA compliance with relevant safety training.

Requirements

• AS or BS in chemistry, chemical engineering, materials, or related science/engineering fields.
• 2+ years of hands-on laboratory experience.

Preferred Qualifications

• Self-driven problem-solving skills.
• Strong team collaboration and communication skills.
• Semiconductor Fab experience.
• Vacuum systems experience.
• Thin film deposition (ALD/CVD) experience.
• Experience in an industrial company focused on materials development and advanced materials manufacturing.

Work Environment

Work is carried out in a research and development laboratory, specifically a cleanroom environment. The role involves handling hazardous chemicals and breathable powders, requiring strict adherence to safety protocols. The employee must wear appropriate safety equipment, including eye protection, respiratory protection, gloves, steel-toe shoes, lab coat, and cleanroom attire. The environment demands constant attention to safety, environmental, and health concerns.

Physical Demands

The physical demands include occasional work near moving mechanical parts in a moderate noise-level environment. The employee is regularly required to stand, walk, use hands to handle or feel, and reach with hands and arms. Occasional lifting of up to 40 lbs may be required.

Pay

Salary range: $74,000 - $107,000 per year. Final compensation is determined based on skills, experience, and internal equity.

Benefits

• Comprehensive benefits package including medical, dental, vision, disability, and life insurance.
• Paid time off and holidays.
• Flexible Spending Account (FSA).
• 401(k) plan.