Wafer Bond Process Engineer

Key Responsibilities

• Serve as the technical owner for wafer bonding processes supporting MEMS manufacturing.
• Sustain high-volume production processes through monitoring, troubleshooting, and continuous improvement activities.
• Drive process stability, yield improvement, defect reduction, cycle time reduction, and cost optimization.
• Lead root-cause investigations for process excursions and implement corrective and preventive actions.
• Develop and maintain process specifications, operating procedures, work instructions, control plans, and FMEA documentation.

Wafer Bonding Technology Leadership

• Demonstrated expertise in wafer-to-wafer and wafer-to-carrier bonding technologies, including direct, adhesive, anodic, oxide, and ionic bonding methods, supporting MEMS, sensors, photonics, biochips, advanced packaging, and heterogeneous device integration applications.
• Experience in surface preparation and pre-bond cleaning processes including plasma treatments, wet cleans, and dehydration bakes to achieve high bond strength and low defectivity.
• Experience with bond alignment, bond tool operation, thermal cure processes, and post-bond processing.
• Utilize metrology, IR inspection, and analytical techniques to evaluate bond integrity, alignment accuracy, defectivity, and interface quality.
• Troubleshoot bonding-related challenges including voids, delamination, particles, alignment issues, and interface defects.
• Drive process characterization, optimization, and margin studies using SPC, DOE, capability analysis, yield analytics, and statistical methodologies.

Process Development and Technology Introduction

• Lead development of new bonding processes from concept through manufacturing implementation.
• Define process windows, characterize critical process parameters, and establish robust manufacturing controls.
• Design and execute DOE studies, capability analyses, and process characterization plans.
• Evaluate emerging materials, equipment technologies, and manufacturing approaches to support future technology roadmaps.
• Support New Product Introduction (NPI), technology transfers, and scale-up activities from development to production.

Project Leadership

• Lead cross-functional projects involving process improvements, technology development, equipment implementation, and manufacturing capacity expansion.
• Develop project plans, schedules, risk assessments, resource requirements, and milestone tracking.
• Cook up coordination efforts across Manufacturing, Quality, Equipment Engineering, Integration Engineering, Purchasing, Supply Chain, and external partners.
• Communicate project status, risks, mitigation plans, and technical recommendations to leadership and stakeholders.
• Drive execution of strategic initiatives that improve manufacturing capability, product quality, cost, and operational performance.

Capital Equipment Acquisition and Qualification

• Define technical requirements and specifications for new manufacturing equipment and process capabilities.
• Lead capital equipment projects including vendor evaluations, technical assessments, business justification development, factory acceptance testing, source inspections, installation, and production release.
• Partner with suppliers and internal stakeholders to ensure successful deployment of new tools and technologies.
• Establish equipment acceptance criteria, qualification plans, and performance metrics.
• Support capacity planning and long-term manufacturing capability development initiatives.

Process Qualification and Validation

• Lead qualification of new processes, materials, equipment, and process changes.
• Develop qualification strategies, protocols, and reports to ensure manufacturing readiness and process robustness.
• Utilize statistical methods, gauge capability studies, SPC, and risk-based methodologies to support validation efforts.
• Execute process capability assessments and manufacturing readiness reviews.
• Drive implementation of validated solutions into production while ensuring compliance with quality system requirements.

Required Qualifications

• Bachelor’s degree in Chemical Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or related engineering discipline.
• 5+ years of semiconductor, MEMS, advanced packaging, photonics, sensor manufacturing, or related process engineering experience.
• Demonstrated experience with wafer bonding technologies in manufacturing and/or development environments.
• Strong understanding of process control methodologies including SPC, DOE, process capability analysis, statistical data analysis, and process qualification.
• Experience troubleshooting complex manufacturing processes and implementing sustainable solutions.
• Proven track record leading technical projects across cross-functional organizations.
• Experience leading process development efforts from concept through manufacturing deployment.
• Experience supporting capital equipment acquisition, installation, and qualification.
• Strong written, verbal, and presentation communication skills.
• Proven analytical problem-solving and technical leadership capabilities.

Preferred Qualifications

• Advanced degree (M.S. or Ph.D.) in Engineering, Materials Science, Physics, or related discipline.
• Experience with MEMS manufacturing technologies and cleanroom operations.
• Experience supporting sensor, photonics, biochip, advanced packaging, or heterogeneous integration applications.
• Experience leading capital equipment acquisition and implementation projects.
• Experience with process qualification, validation, and manufacturing readiness activities.
• Knowledge of FMEA, Control Plans, risk-based process development, and quality management systems.
• Familiarity with wafer inspection, metrology, failure analysis, and materials characterization techniques.
• Experience engaging with external suppliers and equipment vendors.
• Formal project management experience leading multidisciplinary engineering teams.
• Experience supporting technology development, NPI, and process transfers into production.

Preferred Competencies

• Technical leadership and influence across organizations.
• Strong project and program management skills.
• Ability to lead through ambiguity and drive execution.
• Effective collaboration with internal and external stakeholders.
• Continuous improvement mindset.
• Strategic thinking balanced with hands-on technical execution.
• Strong data analysis and decision-making skills.
• Passion for developing innovative manufacturing solutions and advancing next-generation technologies.

Pay Range

The pay range for this role is $93,400 to $143,800 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only).

Benefits

HP offers a comprehensive benefits package for this position, including:

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including:
• 4-12 weeks fully paid parental leave based on tenure
• 11 paid holidays
• Additional flexible paid vacation and sick leave (US benefits overview)