Principal Packaging Integration Engineer

Essential Responsibilities

• Defines process integration specifications for assembly flow of co-packaged optics modules driving toward cost, yield, and reliability targets.
• Establishment of manufacturing driven design rules.
• Ensures that all packaged products meet a standardized set of quality expectations by driving through product packaging design reviews, materials selection and FMEAs of customer packaging concepts.
• Driving SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.
• Provides tools and complex analysis of quality issues and associated financial implications.
• Protect the business by ensuring that all necessary requirements are met and that the technology meets the expectations of customers and market to avoid costly re-designs.
• Ensures standardization of site-based quality processes are executed appropriately.
• Drives discipline and qualification robustness through a consistent global qualification process.
• Typically performs one or more of the following: Perform project management and data analysis, Identify and resolve process integration issues and related problems, Develop custom or derivative processes to meet customer needs, Support new designs with module characterization and design rule development, Drive CIP (Continuous improvement plans) to deliver organizational goals.

Other Responsibilities

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Required Qualifications

• PhD, or MS + 2 or more years of experience
• Experience with failure analysis, design of experiments, & packaging process integration.
• Experience in bringing packaged products from development into production.
• Strong written and spoken English communication skills.

Preferred Qualifications

• Materials science, thermal, mechanical, simulation background.
• Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem.
• Expertise in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging.
• Knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing.

Expected Salary Range

$85,000.00 - $146,000.00

The exact Salary will be determined based on qualifications, experience and location.