Principal Field Application Engineering

About the role

The GlobalFoundries Field Application Engineer (FAE) engages with GF's RF and Photonics technology customers early to assess technical needs and identify the best GF technical solutions to satisfy those needs, driving the opportunity to DWIN and on towards tapeout. The FAE should understand and surmount any barriers of adoption the client may have for using GF technologies for their product development. The FAE will work cross-functionally with internal GF technical experts in pursuit of converting these opportunities to revenue.

Essential Responsibilities

• Engage customers to understand their technical needs towards the development of their semiconductor IC products.
• Assess the competitive landscape to identify and advocate winning GF value propositions.
• Partner internally with GF account managers, product marketing, and technical experts in the creation of compelling, application-specific presentations to describe how GF technology solutions can help those customers develop their industry-winning products.
• Work closely with the account management team to merge technical and commercial terms into a design-winning proposal.
• Identify and resolve all issues/concerns to convert the DWIN into product tapeout.
• Where competitive gaps exist, advocate internally for improved features and capabilities of GF solutions to close such gaps.

Other Responsibilities

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Required Qualifications

• Education – Bachelors or Masters degree in electrical engineering or equivalent (e.g. applied physics, etc).
• Experience – Minimum 5 yrs in semiconductor design, tapeout and process.
• Skills – Working knowledge of IC chip design flows and tools from architectural definition through performance characterization for RF and Photonics technologies. Technical Program Management, active thinking, positive attitude, problem-solving, strong responsibility and ownership, teamwork and personal communication skills are critical.

Preferred Qualifications

• Education – Master’s or PhD in electrical engineering or equivalent.
• Experience – 5 yrs in semiconductor product design at the chip or module level.
• Skills - Direct experience in IC chip design flows and EDA tools from architectural definition through performance characterization. Exposure/Experience in one or more of Digital / Analog Mixed Signal/HV Power/eNVM/Millimetre Wave/Silicon Photonics IC product design highly desirable. SOC product integration/design experiences highly desirable.
• Demonstrated expertise in business development within the Defense Industrial Base or related government agencies Project management skills - i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. Strong written and verbal communication skills. Strong planning & organizational skills.

Expected Salary Range

$81,000.00 - $131,000.00. The exact Salary will be determined based on qualifications, experience and location.