Manager Programs 2 - Advanced Packaging

Relocation assistance is not available. A U.S. Government Secret clearance is required to start; ability to obtain and maintain Special Access Programs (SAPs) clearance and occasional travel to classified areas is required. Travel is expected up to 10% of the time.

About the role

Northrop Grumman Mission Systems (NGMS) Sector is seeking a Manager Programs 2 to join the Northrop Grumman Microelectronics Center (NGMC) in Linthicum, MD. This role supports the Foundry, Test, and Advanced Packaging Operating Unit’s Advanced Packaging team, which develops and deploys next-generation microelectronics packaging technologies for future defense systems. The team focuses on development, prototyping, maturation, and scaling of advanced packaging technologies to meet sector and operating division needs.

For over 70 years, Northrop Grumman’s Microelectronics Center has pushed boundaries in microelectronics, operating U.S.-based, government-trusted foundries and state-of-the-art advanced packaging facilities. The center designs and delivers millions of defense and commercial microelectronics components annually, providing mission-tailored solutions with unparalleled performance.

Responsibilities

• Shape, capture, and execute advanced packaging technology development, prototyping, and maturation programs.
• Manage cost, schedule, and technical performance of programs, ensuring delivery of all contractual requirements on time and within budget.
• Lead interfaces with internal and external customers, supplier partners, and company support organizations.
• Support insertion of technologies into IRAD, CRAD, or production programs.
• Identify growth opportunities and play significant roles in bid and proposal activities.
• Interface with technical leadership across Northrop Grumman to identify technology needs and timelines for next-generation systems.
• Cultivate customer relationships to develop further opportunities within the customer community.
• Develop new business opportunities through strategic planning, capture planning, and proposal development.
• Establish and lead cross-functional Integrated Program Teams (IPT) to meet program cost, schedule, and technical performance objectives.
• Measure and report program performance, delivering presentations to customers, executive management, and stakeholders.
• Participate in contract negotiations, including changes, specifications, budgets, schedules, and key terms.
• Establish design concepts, criteria, and engineering efforts for product research, development, integration, and test.
• Create, review, and finalize program Statements of Work.
• Identify, distribute, track, and complete program requirements.
• Establish and manage program and subordinate baselines.
• Develop and adhere to budget baselines using Earned Value Management (EVM) or similar methodologies.
• Identify, allocate, and manage program resources, including workforce planning.
• Manage Government/customer-supplied property or information (GFE, CFE, etc.).
• Manage suppliers to meet program objectives.
• Ensure adherence to internal processes, policies, and industry standards.
• Ensure program teams understand and adhere to contract scope, managing change through control board activities.
• Develop and adhere to master plans and schedules.
• Conduct thorough risk and opportunity management, including identification, mitigation, and realization.

Requirements

• Bachelor’s degree and 8+ years of relevant experience, or Master’s degree and 6+ years of relevant experience, or PhD and 3+ years of relevant experience supporting U.S. Government contracts and customers and/or project management in commercial industry.
• Demonstrated experience leading teams in task performance on schedule, at cost, and meeting all requirements as a project lead, integrated program team, or cost account manager.
• Demonstrated technical experience supporting research, development, production, and deployment of microelectronics and advanced packaging technologies.
• Demonstrated verbal and written communication skills, including development and delivery of white papers, proposals, technical presentations, customer briefings, and program reviews.
• Demonstrated experience utilizing Earned Value Management (EVM), integrated schedule, and Agile methodologies for program execution, cost/schedule performance tracking, and risk management.
• Ability to travel domestically as required.
• U.S. citizenship required.
• Active U.S. Government Secret clearance required to be considered; ability to obtain and maintain Special Access Programs (SAPs) clearance.

Preferred Qualifications

• Master’s or Ph.D. in a science or technology field related to microelectronics and semiconductors.
• Demonstrated experience managing research, development, and manufacturing of microelectronics and advanced packaging.
• Demonstrated experience interfacing with U.S. Government, defense, and commercial customers to define technical solutions for microelectronics fabrication and/or packaging needs.
• Demonstrated knowledge of customers' planning, program creation, and program management processes.
• 5+ years of experience leading semiconductor technology development or production programs, operations management, or knowledge of RF and digital system products and enabling technologies.
• Familiarity with Federal Acquisition Regulations (FAR) and Defense Federal Acquisition Regulations (DFAR).
• Active U.S. Government Top Secret clearance.

Benefits

• Comprehensive health plan.
• Savings plan (401k).
• Paid time off (PTO) and holidays.
• Education assistance and training/development opportunities.
• 9/80 work schedule (where available).
• Discretionary bonuses and eligibility for overtime or shift differential, depending on the position.
• Life and disability insurance.
• Long-term incentives for eligible employees in Vice President or Director positions.

Pay

Primary salary range: $153,800.00 – $230,800.00. The final offer considers factors such as scope and responsibilities of the position, candidate experience, education, skills, and current market conditions. Eligible employees may receive overtime, shift differential, and discretionary bonuses in addition to base pay. Annual bonuses are designed to reward individual contributions and company results.