Dry Etch Process Development Engineer (42024)

Under the direction of the Director of Dry Etch Process Development, this role focuses on developing and implementing new RIE, IBD, and Ashing processes for next-generation magnetic recording heads, including process control schemes to ensure manufacturability. The position is based in Milpitas, California.

Responsibilities

• Develops and implements new dry etch processes (RIE, IBE, and Ashing) for next-generation magnetic recording heads.
• Implements new process control schemes or methodologies to ensure product manufacturability.
• Designs and conducts experiments, analyzes data, and develops recommendations for improving performance and yield while reducing scrap.
• Adheres to timelines for introducing new processes into the manufacturing line.
• Reviews characterization data from FIB, SEM, and TEM tools to conduct root cause analysis and recommend corrective action.
• Partners with other groups and departments, including process and product engineering, to develop and deliver products and programs.
• Oversees the work of Process Technicians to ensure accurate process execution and efficient wafer disposition.
• Partners with Equipment Engineering to research, select, and qualify new RIE tools.
• Adheres to all safety policies and procedures as required.
• Performs other duties of a similar nature or level.

Requirements

• Bachelor’s degree in Materials Science, Physics, or Electrical Engineering (or equivalent relevant experience); Master’s degree preferred.
• One to three years of experience in the magnetic recording head, hard disk drive, or semiconductor industry in dry etch process development.
• Experience working in a wafer fab manufacturing environment.
• Experience with Statistical Process Control (SPC).
• Proficiency in Microsoft Office Applications.

Skills

• Knowledge of semiconductor or HDD industry principles, practices, and techniques.
• Knowledge of wafer fabrication processing techniques, including process development and integration practices.
• Knowledge of Reactive Ion Etching (RIE), IBE, and Ashing principles, practices, and techniques.
• Knowledge of TEM, SEM, and FIB and ability to analyze data from these sources to determine root cause of failure.
• Ability to use Statistical Process Control (SPC) to analyze data, create reports, present findings, and recommend action.
• Strong verbal and written communication skills for interacting with all levels of employees, contractors, consultants, and management.
• Demonstrated organizational, time management, problem-solving, and troubleshooting skills.
• Flexibility and ability to prioritize tasks effectively.

Pay

The annual base salary for this full-time position ranges from $120,819.00 to $177,675.00, plus bonus target and benefits. Individual pay may vary based on job responsibilities, experience, skills, education, and other factors.

Schedule

Primarily Monday through Friday in an office environment. The schedule may occasionally be adjusted to meet business or operational needs, including potential travel between sites. Work may also take place in a Class 100 ESD-sensitive wafer fab manufacturing facility, requiring adherence to safety and dress standards.

Working Conditions

• Exposure to hazardous chemicals, fumes, or vapors and excessive noise in the wafer manufacturing facility.
• Requires standing, walking, fine grasping movements, bending, and twisting.
• Operates computers, telephones, and other office equipment.
• Occasional requirement to push, pull, or lift up to 10 pounds.