Process Engineer, Dry Etch

About the role

The Dry Etch Process Engineer is responsible for supporting the development of manufacturable, repeatable, and high-yielding processes for state-of-the-art devices in Aerospace, Defense, Bioelectronics, and High-Speed Communications.

You will partner with Integration Engineers, Customers, and other Development Engineers to execute experiments and optimize processes for Fab Operation. This role involves collaborating with Product Engineering and Integration to ensure effective new product introductions, consistent device performance, and quality.

Responsibilities

• Guide and assist Process Technicians through challenging process steps.
• Analyze metrology results and disposition lots based on data and pass/fail criteria.
• Report and summarize metrology analysis results, providing guidance to Integration and Process Development teams.
• Provide effective pass-downs to support uninterrupted Dry Etch operations.
• Sustain and improve wafer fabrication processes, partnering with equipment engineering, operations, and management to enhance cycle time, tool availability, quality, and yields.
• Use Document Control, Process Work Instructions, and Manufacturing Execution Systems to maintain knowledge of applicable codes and standards.
• Ensure manufactured products conform to specifications and application requirements.
• Partner with Senior Development and Integration teams to resolve technical issues by establishing hypotheses, designing experiments, identifying root causes, implementing corrective actions, documenting improved processes, and training operations.
• Sustain existing processes in Reactive Ion Etching (RIE), Deep RIE (DRIE), Magnetron RIE (MRIE), Inductively Coupled Plasma etching (ICP), Microwave Ashing, Transformer Coupled Plasma etching (TCP), Dipole Ring Magnetron etching (DRM), and Barrel etching.
• Create and maintain etch process recipes, perform inspections, control defects, and use standard Dry Etch metrology such as ellipsometry or profilometry.
• Monitor process health with Statistical Process Control (SPC) and respond to out-of-control events.

Requirements

• Processing experience in a fab with Dry Etch technologies: Reactive Ion Etching (RIE), Deep RIE (DRIE), Magnetron RIE (MRIE), Inductively Coupled Plasma etching (ICP), and Microwave Ashing.
• Experience with Statistical Process Control (SPC).
• Basic understanding of algebraic concepts and semiconductor processing.
• Data extraction, analysis, and reporting experience.
• Ability to troubleshoot problems and address root causes.
• Understanding of maintenance activities to ensure healthy and repeatable processes.
• Ability to plan, prioritize, and perform multiple overlapping tasks to meet goals and timelines.
• Operate processing tools, write and run Dry Etch recipes, inspect wafers under a microscope, and perform basic characterization related to Dry Etch processing (particles/defects metrology, thickness/uniformity metrology).
• Ability to work offset shifts: Front-End Days (Sunday–Thursday) or Back-End Days (Tuesday–Saturday).

Qualifications

• BS in Electrical Engineering, Material Science, Physics, Chemistry, or related field + 9 years of experience.
• MS + 7 years of experience, or Ph.D. + 4 years of experience.

Skills

• Hands-on mindset
• Excellent communication skills
• Collaboration
• Quick learner
• Strong interpersonal skills
• Self-starter
• Prioritization
• Accountability

Work Environment

• 80%+ of work is performed in a temperature-controlled cleanroom environment requiring full-body gowning, over-boots, over-hood, safety glasses, and other PPE.
• Frequent gowning and de-gowning required.
• Exposure to frequent interruptions, static noise, alarms (auditory and flashing lights), and hazardous materials.

Physical Demands

• Frequently stationary (sitting/standing for prolonged periods up to 3 hours).
• Frequently viewing a computer monitor for prolonged periods (3+ hours).
• Frequently walking around the Fab for prolonged periods (3+ hours).
• Occasionally required to push/pull or lift/carry 50+ lbs objects or tool components.
• Occasionally required to reach, bend, twist, squat, kneel, and stoop to access tools.
• May require repetitive motions involving wrists, hands, and fingers.
• May require working in tight and confined spaces.
• Occasionally handle items using small and large ranges of motion (e.g., fingers, hands, arms, shoulders).
• Constantly required to wear PPE.

Benefits

• Competitive salary
• Medical, dental, and vision coverage
• 401(k) savings plan
• Company-paid life insurance
• Company-paid disability
• Paid holidays and vacation
• Gym membership discounts

Pay

Expected salary range: $100,000–$150,000 per year, depending on qualifications and experience.

Schedule

• Front-End Days: Sunday–Thursday
• Back-End Days: Tuesday–Saturday

This position is subject to International Traffic in Arms Regulations (ITAR). All applicants must be U.S. persons (U.S. Citizen, U.S. Permanent Resident, Political Asylee, or Refugee).