APTD SWA Module Engineer On-Shift (Day shift)

Join Intel's Advanced Packaging Technology Development Substrate and Wafer Assembly (APTD SWA) organization. Our mission is to be the supplier of choice for leading-edge, cost-effective substrate packaging solutions. As a member of the APTD SWA team, you will contribute to advancing innovative packaging technologies while working in a collaborative and rewarding environment.

Responsibilities

• Receive written and verbal shift pass-downs from the outgoing shift and align priorities with management.
• Spend the majority of the shift on the factory floor supporting equipment and process-related issues while creating and updating specifications and Requests for Change (RFCs) as needed.
• Execute non-standard procedures and perform panel inspections and imaging activities to collect development data.
• Communicate critical issues and updates to tool owners, lot owners, and other stakeholders.
• Provide thorough written and verbal shift pass-downs to incoming shift personnel to ensure seamless operational continuity.
• Support new tool qualification and enablement activities.
• Assist with lot disposition decisions and process recovery actions to maintain production flow.

Qualifications

Minimum Qualifications:

• Bachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related technical discipline, along with 2+ years of experience in a combination of lithography, exposure mask processes, wet etch processes, and dry etch processes.
• OR Master's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related technical discipline, along with 1+ year of experience in a combination of lithography, exposure mask processes, wet etch processes, and dry etch processes.

Preferred Qualifications:

• Experience with statistical data analysis, process characterization, and manufacturing quality systems.
• Experience applying Design of Experiments (DOE) methodologies and Statistical Process Control (SPC).
• Knowledge of manufacturing process control and reliability testing.
• Experience in semiconductor manufacturing, advanced packaging, or packaging substrate development.
• Familiarity with metrology tool recipe development, optimization, and troubleshooting.
• Demonstrated ability to solve complex technical problems and collaborate effectively across cross-functional teams.
• Knowledge of factory operations and continuous process improvement methodologies.

Skills

The ideal candidate will demonstrate:

• Strong problem-solving, analytical, and troubleshooting skills.
• Effective verbal and written communication skills, with the ability to collaborate across engineering teams, factory personnel, and customers.
• Flexibility and adaptability in a fast-paced manufacturing environment.
• Ability to work independently with minimal supervision while managing changing priorities.
• Strong organizational skills and a proactive, self-motivated approach.
• Commitment to achieving both individual and team objectives.

This position is not eligible for immigration sponsorship.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Pay

Annual Salary Range for jobs which could be performed in the US: $99,030.00 - 162,500.00 USD. The range displayed reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Schedule

This role requires an on-site presence on Shift 5 (United States of America).