Advanced Packaging Metro Module Engineer

About the role

Intel Corporation is a global leader in technology innovation, dedicated to creating world-changing technology that enriches the lives of every person on earth. This position provides you with an exciting opportunity to support the development and ramp-up of high-volume manufacturing processes supporting Intel's next generation of advanced packaging technologies such as FOVEROS-S and EMIB.

Key Responsibilities

• Oversee critical high-volume manufacturing equipment and processes to support the production of advanced integrated circuits.
• Conduct tests and measurements to maintain control of critical dimensions and minimize defectivity within the production line.
• Implement equipment modifications to enhance production efficiency, optimize manufacturing techniques, and meet safety, quality, and cost objectives.
• Manage maintenance, repairs, and upgrades for equipment and associated module components to ensure consistent operational performance.
• Drive continuous improvement initiatives focused on key performance indicators, including safety, quality, cost efficiency, yield, and defect reduction.
• Collaborate with equipment suppliers to resolve technical challenges and implement innovative solutions.
• Lead efforts to install, convert, and qualify equipment during factory ramps, ensuring tools are installed safely, on schedule, and meet quality and matching criteria.
• Develop and refine systems for excursion prevention and discrepant material detection to maintain the reliability of equipment and processes.
• Facilitate technology transfer to global manufacturing sites through training, audits, and support for installation and qualification processes.

Qualifications

• You must possess the below minimum qualifications to be initially considered for this position:
• Bachelor's or BS degree in a STEM-related field or equivalent education.
• A minimum of 4 years of experience with a Bachelor's degree, 3 years with a Master's degree, or no experience with a PhD.
• Experience in equipment monitoring, process characterization, manufacturing process improvement, and semiconductor equipment.
• Experience in manufacturing process change and optical characterization.

• Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates:
• Understanding and hands-on experience with metrology fundamentals, tool matching / calibration and development.
• Experience in process analytical metrology, packaging processes, and process development.
• Experience in experimental design, and their applications to tool matching, qualification, and process optimization.
• Familiarity with semiconductor process flows, particularly advanced packaging, and metrology assessment based on process requirements.
• Experience in project management and leading task forces from problem identification to resolution.
• Experience with equipment automation development and collaborating with equipment suppliers.