Advanced Packaging Process Integration Engineer
Job Details
About the role
The Role and Impact As a Process Integration and Yield Engineer, you will play a pivotal role in driving Intel's mission to deliver world-class semiconductor solutions. This role offers an exciting opportunity to define and execute technology transfer roadmaps, enabling the seamless integration of advanced packaging and backend assembly-test processes from new product introduction (NPI) to high-volume manufacturing (HVM) ramp. You will lead critical yield and quality improvement initiatives, ensuring optimal manufacturing performance. Your expertise will contribute to Intel's commitment to delivering innovative and reliable products that power the world's cutting-edge technologies.
Key Responsibilities
- Define and establish process flows, procedures, and equipment configurations to enable successful technology transfer.
- Analyze large volumes of structured and unstructured data, extracting actionable insights using statistical and machine learning methods, as well as coding tools such as SQL and Python.
- Drive yield improvement initiatives by identifying and resolving low-yield issues, engaging with both internal and external stakeholders.
- Implement continuous improvement programs to proactively prevent quality, line yield, and sort yield excursions.
- Perform quality and reliability risk assessments for manufacturing materials and process changes.
- Mentor and develop technical talent within the team, fostering a culture of innovation and collaboration.
- Act as a change agent to align organizational goals with technical strategies, driving innovation and leadership in the semiconductor industry.
Qualifications
- Minimum qualifications are required to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Bachelor's degree in Engineering, Material Science, Physics, or a related field with 4 or more years of relevant experience, or a Master's degree in Engineering, Material Science, Physics, or a related field with 3 or more years of relevant experience, or a PhD in Engineering, Material Science, Physics, or a related field with no experience.
- Experience listed above should be a combination of the following: Process integration, yield analysis, and quality management in TD or high-volume manufacturing environments. Semiconductor advanced packaging and backend assembly-test process development.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
Pay
Annual Salary Range for jobs which could be performed in the US: $120,860.00 - 170,630.00 USD
Schedule
Shift 1 (United States of America)
Primary Location
US, New Mexico, Albuquerque
Additional Locations
Business Group Intel Foundry
Job Type
Experienced Hire
Work Model
This role will require an on-site presence.