Advanced Packaging Development Engineer

Packaging Technology

Key job scope includes:

• Developing and enabling advanced packaging technology to integrate memory dies and SoC dies into one package for AI related products.
• Supporting development of key components (HBM, iVR, Si Cap) for advanced packaging.
• Managing reliability tests to qualify new technology.
• Leading yield improvement activities for new technology ramp-up.

Requirements

The job requires:

• Intensive experience in related areas such as 2.5D/3D and HBM technology development and reliability/yield improvements.
• Project management and teamwork skills.
• Strength in technology innovation, development, and enablement.

Qualifications

A Master's degree in a related engineering field with at least 10 years (post-degree) of direct experience, or 7 years with a Ph.D. degree, is required.

Compensation and Benefits

The annual base salary range for this position is $127,100 - $203,400. This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package, including:

• Medical, dental, and vision plans.
• 401(k) participation including company matching.
• Employee Stock Purchase Program (ESPP).
• Employee Assistance Program (EAP).
• Company-paid holidays, paid sick leave, and vacation time.

The company follows all applicable laws for Paid Family Leave and other leaves of absence.