Technical Marketing Engineer Advanced IC Packaging

Siemens EDA is a global technology leader in Electronic Design Automation software. Our tools enable companies to develop highly innovative electronic products faster and more cost-effectively. Customers use our tools to push the boundaries of technology and physics in chip, board, and system design.

About the role

The Technical Marketing Engineer drives technical marketing and solution development for EBS-centered offerings in Advanced IC Packaging, with focus on 2.5D and 3DIC design flows. This role translates customer challenges into solution-oriented workflows by connecting planning, layout, and verification tools using scripting technologies such as Tcl and Python.

Responsibilities

• Develop and deliver technical marketing materials such as videos, presentations, and lab/demo content for Advanced IC Packaging solutions.
• Build and demonstrate solution workflows for 2.5D and 3DIC design by connecting multiple tools (planning, layout, verification) using Tcl and Python.
• Engage customers in technical discussions to understand design challenges, workflow gaps, and use-case requirements.
• Translate customer technical requirements and business needs into actionable input for development teams.
• Understand newly developed products and enhancement features, and communicate their technical value to customers.
• Support the definition and evolution of solution concepts that address current and future customer workflows.
• Collaborate with internal teams across product, development, and field organizations to align solutions with market needs.
• Proactively drive assigned responsibilities to support project execution and business objectives.
• Take ownership of deliverables and contribute effectively in project-based activities.
• Help identify and shape future solution opportunities based on customer engagement and market direction.

Requirements

• Native or near-native proficiency in English.
• 5+ years of relevant experience in 2.5D / 3DIC design, Advanced IC Packaging, or technically supporting such flows from an EDA perspective.
• Strong understanding of design workflows spanning planning, layout, and verification.
• Practical scripting experience using Tcl and Python to automate or integrate workflows across multiple tools.
• Ability to engage directly with customers in technical discussions and help define solution use cases.
• Ability to use Linux as an end user in a business or technical environment.
• Proficiency in Microsoft Office products for business use.
• Formal academic background in Electrical Engineering, Electronics, or a related technical field.

Preferred Qualifications

• Experience in technical marketing, application engineering, solution engineering, or other customer-facing technical roles.
• Experience creating technical demonstrations, proof-of-concept workflows, or presentation materials.
• Familiarity with EDA solution positioning for semiconductor or packaging design customers.
• Interest in emerging workflow technologies, including AI- or agent-assisted solution approaches.

Travel

• Customer visits are required; domestic travel is primary, with occasional international travel.

Work Environment

• Collaboration with teams in Asia and Europe may require early morning or evening hours.
• Subject to U.S. export control requirements under ITAR and/or EAR; U.S. Person status or export license required.

Benefits

Flexible work arrangements (home/office), comprehensive benefits, and a diverse, inclusive environment. All employment decisions are based on qualifications, merit, and business need.