Team Lead Co-Packaged Optics (m/f/d)

Responsibilities

• Build, mentor, and disciplinarily lead a high-performing CPO Packaging engineering team;
• Execute gap analyses and strategic hiring to accelerate our scaling roadmap.
• Own the evaluation, qualification, and end-to-end technical management of global OSAT partners, ensuring the secure onboarding of at least two qualified CPO suppliers within 12 months.
• Drive the development of advanced co-packaged photonic/electronic assemblies, mastering deep hardware challenges across optical fiber coupling (Edge Coupling, FAUs), advanced packaging materials, and high-performance thermal management.
• Implement strict Design for Manufacturability (DFM) guidelines and ensure reliability qualification under JEDEC and Telcordia standards.
• Act as the critical interface between internal Chip Design, Systems, Manufacturing, Test, and external supply chain stakeholders to ensure a seamless product introduction (NPI) and volume production roll-out.
• Champion rigorous root-cause analysis utilizing structured frameworks (8D, FMEA, Ishikawa) to rapidly resolve unexpected reliability or process deviations.

Requirements

• You hold a Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, or a closely related technical field.
• You possess at least 5 years of profound experience within the Semiconductor Packaging industry (Back-End / OSAT environment), with a proven track record in global supplier evaluation.
• You have direct, hands-on experience with Co-Packaged Optics (CPO) packaging, optical fiber attachment methods, and navigating advanced packaging materials (substrates, underfills, TIMs).
• You have demonstrated experience in building, scaling, and coaching engineering teams, fostering a culture of high performance and technical accountability.
• You thrive in high-growth, innovative environments, demonstrating an advanced solution-oriented mindset and strong process ownership under tight project milestones.
• You possess exceptional written and verbal communication skills; fluency in English is required.
• Prior experience with glass substrates and proficiency in German are considered a distinct advantage for collaborating with local stakeholders.

Qualifications

Academic Foundation: You hold a Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, or a closely related technical field.

Semiconductor & OSAT Expertise: You possess at least 5 years of profound experience within the Semiconductor Packaging industry (Back-End / OSAT environment), with a proven track record in global supplier evaluation.

CPO & Precision Hands-on Skills: You have direct, hands-on experience with Co-Packaged Optics (CPO) packaging, optical fiber attachment methods, and navigating advanced packaging materials (substrates, underfills, TIMs).

Leadership & Empowerment: You have demonstrated experience in building, scaling, and coaching engineering teams, fostering a culture of high performance and technical accountability.

Analytical Self-Leadership: You thrive in high-growth, innovative environments, demonstrating an advanced solution-oriented mindset and strong process ownership under tight project milestones.

Communication Excellence: You possess exceptional written and verbal communication skills; fluency in English is required.

Prior experience with glass substrates and proficiency in German are considered a distinct advantage for collaborating with local stakeholders.