Lead Optical Packaging Engineer

Responsibilities

• Perform all aspects of package design and verification through the NPI and engineering change process to deliver robust, manufacturable solutions.
• This will be achieved through full understanding of product performance, material implications, project costs and design for manufacture.
• Develop and document manufacturing techniques, materials, tools and processes related to backend Photodiode assembly.
• Performs analyses and selects techniques to solve problems and enhance product yield and process flows.
• Establish high yielding, cost effective processes based on product need and customer requirements.
• Develops and executes Design of Experiments (DOE) for process optimization utilizing appropriate statistical analysis.
• Evaluates and validates process and design alternatives based on product manufacturability.
• Provides packaging solutions which meet demanding product requirements while balancing the need for reliability and cost.
• Follows the NPI gate process, ensures the products meet both internal and customer specifications as required, and that the product is designed for manufacturing.
• Ensures the repeatability and reproducibility of our products and makes suggestions where applicable on next gen fabrication/assembly capabilities.

Requirements

• BS in mechanical engineering, material science, or closely related technical discipline with at least 8 years of industrial experience in semiconductor or photonics die packaging.
• Fluent with material properties, packaging techniques, and manufacturing disciplines including die attach methods, wirebonding, flip chip die attach, seam seal, laser mark, and related qualification techniques.
• Demonstrated experience of working with diverse engineering disciplines.
• Strong manufacturing experience which insures high yield along with controlled process.

Qualifications

• MSME with 6+ years of direct semiconductor or photonics die packaging experience.
• 5 years plus of technical leadership experience in cross-functional teams.
• Design for Six Sigma practices including Root Cause Analysis, Design of Experiments, etc.
• General awareness of FEAbased analysis techniques as related to photonics and PIC package designs would be distinct advantage.

Skills

• Technical leadership skills
• Manufacturing experience
• Design for Six Sigma practices
• FEA-based analysis techniques

Benefits

• Able to lift up to 20lbs
• Travel may be required, likely less than 10%

Pay

• Full-time, exempt position

Schedule

• Flexible schedule to accommodate manufacturing needs

Miscellaneous

• GPD provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state or local laws.
• This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, transfer, leaves of absence, compensation and training.