Lead Packaging Engineer

About the role

The Lead Packaging Engineer at Diraq is responsible for developing and delivering advanced packaging solutions for Diraq's silicon-based quantum processors. This role involves defining packaging strategies that enable scalable, high-performance quantum systems, balancing electrical performance, thermal management, mechanical integrity, and manufacturability.

Responsibilities

• Lead the architectural definition, design, and execution of advanced packaging solutions for quantum processor chips and multi-chip modules
• Own packaging concepts from early feasibility and prototyping through qualification and production readiness
• Partner closely with device, system, RF, and thermal engineering teams to align packaging designs with performance, thermal, reliability, and integration requirements
• Drive the selection and implementation of advanced semiconductor packaging technologies, including:
• Provide technical leadership on PCB and substrate design, signal integrity, power delivery, and cryogenic-compatible materials
• Lead mechanical design considerations, including stress management, CTE mismatch, and assembly robustness
• Own and guide failure analysis and reliability investigations, working with internal teams and external labs to identify root causes and implement corrective actions
• Engage directly with foundries, OSATs, substrate vendors, and research partners to co-develop next-generation packaging capabilities
• Contribute to technology roadmaps, risk assessments, and design trade-off decisions at the program and company level
• Mentor and technically guide junior engineers and cross-functional collaborators

Requirements

• Bachelor’s degree (or higher) in Mechanical Engineering, Electrical Engineering, Materials Science, or a related field
• Significant industry experience in advanced semiconductor packaging for high-performance or deep-tech hardware
• Demonstrated expertise in:
• PCB and/or substrate design for high-density electronics
• Mechanical design for semiconductor assemblies
• Failure analysis, reliability testing, and qualification processes
• Strong understanding of thermal management and mechanical reliability in complex electronic systems
• Proven track record of delivering robust, scalable hardware solutions from concept through manufacturing
• Ability to operate effectively in a fast-moving R&D environment with evolving technical requirements

Qualifications

• Strong understanding of electrical performance, thermal management, and mechanical reliability in complex electronic systems
• Experience working across cross-disciplinary engineering teams and with external manufacturing partners

Skills

• Technical leadership in packaging design and implementation
• Collaboration with cross-functional engineering teams
• Experience with cryogenic electronics or quantum, superconducting, or ultra-low-temperature systems
• Experience supporting technology transfer from R&D into pilot or volume manufacturing
• Exposure to semiconductor foundry or OSAT environments
• Prior technical leadership or mentoring responsibilities

Benefits

Compensation target base salary for this role is $200,000-$260,000 per year + benefits. Our salary ranges are determined by role, level, experience, and location. We are an equal opportunity employer. We value a range of perspectives and experiences and make employment decisions based on merit and business needs. We do not discriminate on the basis of legally protected characteristics. Job Benefits include:

• Paid time off to volunteer for a cause you're passionate about
• Opportunity to work with a talented team of professionals and world experts in the quantum computing field and a distinguished senior leadership team and Board
• A dynamic, supportive, and innovative work environment with opportunities for personal and professional growth
• Exposure and education from leading experts in the ground-breaking technologies that are shaping the future of quantum computing