Substrate/Package Layout Engineer

Responsibilities

• Design and layout advanced substrates and IC packages
• Develop and utilize a script-based layout tools
• Collaborate with design and verification teams to ensure layout meets specifications and performance requirements
• Perform design rule checking (DRC) and layout vs schematic (LVS) check
• Contribute to the development and improvement of layout methodologies and flows

Requirements

• Bachelors degree in Material Science/ Electrical/ Computer/Mechanical Engineering or related science/engineering degree with at least 12 years experience
• Or Masters degree and 10+ years of related experience or PhD and 7+ years of related experience
• Deep knowledge and expertise with using Cadence layout tools and Electronic Design Automation (EDA) tools
• Broad understanding of multilayer high speed rf-design, package/substrate manufacturing processes and materials, and surface mount technology, Simulations of designs and improvement suggestions

Compensation and Benefits

The annual base salary range for this position is $141,300 - $226,000. As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Comprehensive benefits package includes:

• Medical, dental and vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• Company paid holidays, paid sick leave and vacation time

The company follows all applicable laws for Paid Family Leave and other leaves of absence.