Substrate / Advanced Package Engineer (7103)

Overview

We are seeking a highly skilled and motivated Substrate / Advanced Package Engineer to join our cutting-edge 3DIC design team. The ideal candidate will have a strong foundation in semiconductor physics, mechanical engineering principles, and EDA (Electronic Design Automation) tools, with a passion for innovation in advanced package design. The role involves design, simulation, and modeling of complex substrate and packaging technologies to support next generation 3DIC applications.

Responsibilities

• Design, simulate, and optimize advanced packaging for 3DIC applications.
• Collaborate with cross-functional teams to define specifications and requirements.
• Perform modeling of warpage, stress, reliability, and thermal performance using industry-standard EDA tools.
• Formulate and solve problems in research-driven, often ambiguous domains.
• Provide guidance on high-speed I/O modeling and integration.
• Develop and maintain documentation, including specifications, test plans, and design reviews.
• Stay current with industry trends, tools, and technologies in advanced packaging.

Requirements

• Master’s degree or Ph.D. in Electrical Engineering, Mechanical Engineering, or a related field.
• 15+ years of hands-on expertise in advanced packaging technologies and substrate design.
• Understanding of semiconductor device physics and packaging process technologies.
• Strong knowledge of warpage, stress, and thermal effects in packaging.
• Proven ability to drive solutions in ambiguous, research-oriented contexts.
• Excellent problem-solving, analytical, and communication skills.
• Strong collaboration skills, with the ability to mentor junior engineers.
• Ability to balance strategic insight with hands-on technical execution.

Preferred Skills

• Experience with reliability, IR/EM, and multi-physics analysis.
• Familiarity with machine learning techniques for design optimization.
• Patents, publications, or demonstrated innovation in substrate or packaging domains.

Success Metrics

• Ability to provide impactful, data-driven suggestions that influence design direction.
• Effective use of modeling and simulation to validate proposals.
• Establishing trust and credibility with global teams.
• Enabling adoption of new technologies within the 3DIC ecosystem.