Sr. Process Engineer

We are seeking a highly skilled Manufacture Process Engineer to lead and optimize manufacturing processes for Printed Circuit Board Assemblies (PCBA). This role is critical in ensuring high-quality, reliable, and cost-effective production through expertise in stencil design, soldering processes, wave solder profiling, conformal coating, and secondary operations. The ideal candidate will bring deep technical knowledge, hands-on experience, and a continuous improvement mindset to advance our PCBA manufacturing capabilities. ⚙️ Key Responsibilities Process Development & OptimizationDesign, validate, and optimize stencil designs for solder paste application.Develop and maintain reflow soldering profiles, including vapor phase reflow processes, to ensure robust solder joints and minimize defects.Establish and refine wave soldering profiles for through-hole components.Define and implement secondary operations including press-fit connector installation, heat sink attachment, and mechanical assembly steps.Develop and oversee conformal coating processes to ensure environmental protection and product reliability.Create and enforce rework standards for soldering, ensuring compliance with IPC and industry best practices.Manufacturing SupportProvide technical leadership to production teams in troubleshooting assembly issues.Collaborate with design engineering to ensure manufacturability of PCB layouts and component selection.Drive yield improvement initiatives and root cause analysis for process-related defects.Lead Corrective and Preventive Action (CAPA) initiatives to eliminate recurring issues and strengthen process robustness.Support new product introduction (NPI) by developing scalable and repeatable assembly processes.Quality & ComplianceEnsure adherence to IPC-A-610, J-STD-001, IPC-7711/7721, and other relevant industry standards.Maintain documentation of process parameters, work instructions, and control plans.Partner with quality engineering to implement corrective and preventive actions (CAPA).Continuous ImprovementLead projects focused on automation, efficiency, and cost reduction.Evaluate and introduce new technologies, equipment, and materials to enhance PCBA processes.Train and mentor junior engineers and technicians in advanced assembly techniques. Qualifications & Experience Education: Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field. Master’s preferred.Experience: Minimum 7–10 years in PCBA manufacturing engineering, with proven expertise in:Stencil design and solder paste application.Reflow soldering (including vapor phase reflow) and thermal profiling.Wave soldering process development and optimization.Conformal coating application and process control.Secondary operations (press-fit connectors, heat sinks, mechanical assembly).Rework and repair standards for solder joints.Root cause analysis and CAPA methodologies for troubleshooting and issue resolution.Strong knowledge of IPC standards (IPC-A-610, J-STD-001, IPC-7711/7721).Hands-on experience with SMT equipment, AOI/X-ray inspection, and process monitoring tools.Demonstrated success in NPI process development and scaling to volume production.Excellent problem-solving, analytical, and communication skills.Ability to lead cross-functional teams and drive process improvements in a fast-paced environment. Preferred Skills Experience with Design for Manufacturability (DFM) and Design for Test (DFT) principles.Familiarity with Lean Manufacturing and Six Sigma methodologies.Proficiency in CAD tools for stencil and fixture design.Knowledge of advanced soldering techniques (selective soldering, laser soldering).Strong project management and leadership capabilities. Benefits 401(k)401 (k) matchingDental insuranceHealth insuranceVision insurancePaid time off