Senior Technologist, Hybrid Bonding Module

Key Responsibilities

• Drive process and/or equipment development for die-to-wafer hybrid bonding, including material selection, parameter optimization, equipment characterization, and process control.
• Develop and optimize manufacturing processes to improve yield, reliability, and defectivity performance.
• Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control.
• Design and execute DOE-based experiments and perform statistical analysis to establish robust process windows and control strategies.
• Lead first-of-a-kind (FOK) process and equipment capability development for new bonding platforms and technologies.
• Identify and implement process and equipment improvements to enhance manufacturing capability, efficiency, and output.
• Conduct process feasibility studies using characterization, modeling, simulation, and experimental methodologies.
• Partner with equipment suppliers and materials vendors to develop enabling process and hardware solutions.
• Collaborate with technology development, process integration, and manufacturing organizations to drive process maturity and continuous improvement.
• Contribute to future technology roadmaps through evaluation of emerging hybrid bonding technologies.

Qualifications

• Minimum Qualifications: Bachelor's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 9+ years of experience; OR Master's degree in the same fields and 6+ years of experience; OR PhD in the same fields and 4+ years of experience.
• Experience: 5+ years of industry experience in hybrid bonding, wafer bonding, advanced packaging, or closely related semiconductor manufacturing technologies.