Senior Engineer - Cu Hybrid Bonding

Key Responsibilities

• Drive end-to-end development of copper hybrid bonding processes for advanced packaging and 3D integration.
• Define technical roadmap, milestones, and deliverables aligned with business objectives.
• Collaborate with materials innovation and formulation teams to develop novel electroplated Cu for low temperature bonding processes.
• Develop and optimize copper surface preparation, grain structure control, and bonding interface engineering to meet industry goals for CHB.
• Implement advanced characterization techniques (e.g., EBSD, TEM, AFM) to analyze grain orientation and bonding quality.
• Collaborate with global technology and commercial teams to promote technically differentiated Cu bonding technology.
• Act as the primary technical interface with customers to align bonding technology with product requirements.
• Partner with plating tool OEMs to evaluate, qualify, and optimize formulation for copper bonding and surface engineering.
• Identify opportunities for process differentiation and file patents to protect intellectual property.
• Stay ahead of industry trends and benchmark against leading-edge CHB technologies.

Qualifications

• Master’s degree in Materials Science, Chemistry, Chemical Engineering, Metallurgy, Electrical Engineering, or related field with a minimum of 4+ years relevant experience preferred.
• Or Ph.D. in Materials Science, Chemistry, Chemical Engineering, Metallurgy, Electrical Engineering, or related field, with 1+ years relevant experience preferred.
• Experience and knowledge in semiconductor packaging or interconnect technology development required.
• Proven expertise in grain engineering, copper bonding, and hybrid bonding processes.
• Hands-on experience with electrochemical deposition, CMP, and surface activation techniques.
• Strong analytical and problem-solving skills.
• Familiarity with reliability testing and failure analysis for bonded interfaces.
• Excellent communication and leadership abilities.

Preferred Qualifications

• Hands-on experience with hybrid bonding, TSV plating, and damascene metallization.
• Familiarity with additive chemistry development for electroplating baths.
• Knowledge of failure analysis, stress modeling, and reliability testing.
• Track record of patent generation and technical leadership.

Soft Skills

• Excellent problem-solving and analytical skills.
• Strong communication and collaboration abilities.