Senior Process Engineer

Responsibilities

• Own development of wafer prep and die-level packaging processes: bumping, dicing, sub-micron precision bonding, sub-micron optical alignment, flip-chip die bonding, wire-bonding, dispense, fully-automated final assembly and associated materials
• Own tool selection, materials selection, recipe development, and statistical process control limits to transfer processes from R&D to volume production
• Translate package and product designs into high volume production processes and collaborate with electrical, mechanical, and photonic circuit design teams to design-for-manufacturing
• Design production processes from the lab bench through proof of concept and production ramp
• Establish process limits and feedback process constraints as design rules to design teams
• Characterize parts with x-ray, FIB cut/SEM, CSAM, and die shear testing, closing the loop with electrical, mechanical, and photonic circuit design teams
• Act as the technical owner for failure-analysis findings, root cause analysis, and corrective actions
• Push process yields above 99.9% and thermal-cycle reliability for years-long qualification
• Provide technical mentorship as we work to build up high-volume semiconductor packaging process engineering in the US

Qualifications

• MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, or similar
• Extensive (MS + 2 years) hands-on semiconductor process-development experience
• Strong troubleshooting skills and hands-on experience in semiconductor packaging, assembly, or advanced manufacturing environments
• Demonstrated success qualifying processes such as flip-chip bonding, wafer processing, plasma cleaning, and wire bonding
• Expertise in statistical quality control and process improvement methodologies, with experience leading internal audits and driving continuous improvement
• Comfortable working in a cleanroom or controlled manufacturing environment with cross-functional engineering teams
• Willingness to work extended hours and weekends as needed

PREFERRED EXPERIENCE

• 5+ years of fab or wafer level packaging experience (e.g. lithography, etch, CVD, CMP, solder bumping, wafer dicing)
• Experience integrating photonic devices into complex opto-electronic packages, sub-µm die-bonding, wafer prep, and materials used in advanced packaging

Compensation and Benefits

• Pay range: Senior Process Engineer: $140,000.00 - $180,000.00/per year
• In addition to base salary, compensation for this role includes:
• Eligibility for long-term incentives including company stock options and discretionary bonuses awarded for exceptional achievements.
• Comprehensive medical, vision, and dental insurance with significant cost covered by the company for yourself and dependents.
• Paid parental leave and flexible PTO (3 weeks accrued vacation and 10 company holidays per year).
• 401(k) retirement plan access.
• Relocation assistance to sunny Los Angeles.