Senior Packaging Engineer

Lead the development of RF/microwave plastic, ceramic, and metal packages from concept through production release. Provide thermal design and analysis for package and system-level physical designs, ensuring compliance with MIL-SPEC standards. Manage multiple product development programs in parallel, deliver on schedule, and drive technical ideation for proposals and non-recurring engineering activities.

Responsibilities

• Technical lead for RF/microwave plastic, ceramic, and metal packages.
• Collaborate with internal teams (product design, QA, reliability, failure analysis, supply chain) and external suppliers to develop, apply, and qualify packaging technologies and assembly processes, focusing on cost, high-volume manufacturability, yield, and quality.
• Establish and update design rules for packaging with vendors and internal engineering resources.
• Implement robust assembly processes internally and with contract manufacturing (CM) partners.
• Troubleshoot packaging defects, define solutions, and implement corrective actions.
• Characterize failure modes with the Quality organization and analyze them as a function of packaging materials and processes.
• Provide thermal modeling and application notes for new packages.

Requirements

• 7+ years of professional experience in RF/Microwave hardware development; Aerospace/Defense industry background preferred.
• Proficiency in RF circuit/component design, systems engineering, prototyping, assembly, linear/non-linear RF/microwave modeling and testing, and researching ferromagnetic phenomena in materials.
• Bachelor’s degree in Mechanical Engineering, Materials Engineering, or related field with a focus on Surface Mount Packaging development. Master’s degree or PhD is an advantage.
• Expertise in advanced IC package process development, design, and thermal analysis with emphasis on RF and Microwave ICs.
• Knowledge of product characterization and reliability testing standards (JEDEC, IPC, EIA, RoHS, WEEE).
• Experience in failure analysis methodology and solving steady-state/dynamic thermal and mechanical problems using FEA and CFD software.
• Deep knowledge of materials used for RF components and module packaging and assembly.
• US Citizenship or Permanent Residency required; ability to obtain a Security Clearance (Secret).

Benefits

• 401(k) with matching
• Dental insurance
• Paid time off
• Tuition reimbursement

Pay

$140,000 – $170,000 per year

Schedule

Standard, full-time, on-site in Marlborough, MA.