Senior ASIC Physical Design Engineer

About the role

We are seeking a Senior ASIC Physical Design Engineer to help implement advanced SoCs that power next-generation satellite and space systems. In this role, you will contribute to the full physical design flow—from synthesis to GDSII—working closely with architecture, RTL, verification, and packaging teams. You’ll be a key contributor in achieving timing closure, optimizing PPA, and supporting design integration with external partners. You will be part of a collaborative design team developing state-of-the-art mixed-signal SoCs to be hosted on some of the largest, most powerful, rapidly designed and rapidly manufactured satellites ever deployed in space.

In your first 6 months, you will develop and implement new SoC sub-systems for satellite communications and beyond. In your first two years, you will have contributed to developing cutting-edge SoCs that will fly in space.

Responsibilities

• Execute the complete physical design flow for complex SoC blocks and top-level integration, including synthesis, floorplanning, place & route, CTS, STA, and physical verification.
• Perform timing closure and optimization across multiple corners and modes using industry-standard tools.
• Collaborate with front-end, verification, and DFT teams to ensure clean handoff and predictable convergence.
• Work with external physical design service providers and internal leads to review deliverables, resolve issues, and ensure schedule alignment.
• Develop and maintain scripts and automation to improve flow efficiency and consistency.
• Support physical sign-off activities including DRC/LVS, IR drop, EM, and power analysis.
• Assist in chip-level integration, ECOs, and tapeout preparation.
• Contribute to methodology development, tool evaluation, and flow documentation.
• Support your product through production and spaceflight.

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field.
• 5–10 years of experience in ASIC physical design for complex SoCs.
• Hands-on experience with industry-standard tools (Synopsys ICC2/Fusion Compiler, Cadence Innovus, or equivalent).
• Strong understanding of timing analysis, power optimization, and physical verification flows.
• Experience with hierarchical or flat SoC design methodologies.
• Familiarity with FinFET technologies.
• Working knowledge of DFT, UPF/CPF power intent, and ECO implementation.
• Strong problem-solving skills and ability to work cross-functionally in fast-paced environments.

Qualifications

• Exposure to radiation-hardened or space-qualified ASICs.
• Experience with chip-package co-design or advanced packaging (2.5D/3D).
• Familiarity with physical design service vendor management or offshore collaboration.
• Experience with sign-off through TSMC.
• Experience with Gate-All-Around technologies.
• Experience working in cross-functional, geographically distributed teams.

Benefits

• Comprehensive benefits package including paid time off, medical/dental/vision coverage, life insurance, paid parental leave, and many other perks.

Pay

Base salary range for this role is $170,000 – $250,000 + equity in the company. Salary will be based on several factors including, but not limited to: knowledge and skills, education, and experience level.

Export Compliance: The person hired for this role must be a “U.S. person” as defined by 22 C.F.R. 120.15 or otherwise eligible for a federally issued export control license, due to access to information and items controlled by U.S. export control regulations, including ITAR.