Process Engineering Manager - Films, Dry Etch, Wet Etch, & Plating

About the role

The Process Engineering Manager - Films, Dry Etch, Wets and Plate leads a team of process engineers and technical contributors responsible for wafer fabrication process development, sustaining, yield improvement, and technology transfer activities across assigned modules. This role provides senior technical and people leadership across thin films, dry etch, wet etch, cleans, plating, electrochemical processing, and related metrology in a cleanroom manufacturing environment.

Primary Scope

• Lead process development, optimization, qualification, and sustaining activities for films, dry etch, wet etch, cleans, plating, and associated metrology processes.
• Provide senior-level technical direction for thin film deposition, plasma etch, wet etch, cleans, electroplating / plating, process control, tool matching, and module-level integration interactions.
• Drive process capability, yield improvement, defect reduction, film uniformity, etch selectivity, critical dimension control, contamination control, plating quality, and cost-of-ownership initiatives.
• Lead root-cause investigations and corrective actions for process excursions, yield limiters, defectivity issues, tool matching gaps, contamination concerns, and reliability risks.
• Apply DOE, SPC, process window analysis, statistical methods, and process capability analysis to improve process robustness and manufacturability.
• Partner with integration, device, product, equipment, quality, operations, reliability, and program teams to resolve complex technical issues and meet customer commitments.
• Guide new technology development, process transfer, process release, and qualification activities across CMOS, MEMS, photonics, photovoltaic, or heterogeneous integration / advanced packaging fabrication environments.
• Establish and monitor key process metrics including yield, defects, tool matching, process capability, film thickness and uniformity, etch rate and uniformity, plating thickness, contamination control, documentation health, and excursion response.
• Ensure compliance with safety, quality, documentation, change-control, customer, and cleanroom operating requirements.
• Communicate status, risks, recovery plans, resource needs, and execution priorities clearly to senior leadership and cross-functional stakeholders.

Required Qualifications

• B.S., M.S., or Ph.D. degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, or another relevant engineering discipline.
• Minimum of 15 years of experience in a wafer fabrication cleanroom environment.
• Minimum of 2 years of leadership, supervisory, or management experience, preferably with direct people leadership responsibility.
• Experience as a process or area owner for at least two relevant process areas such as thin films, dry etch, wet etch, cleans, plating, electrochemical deposition, or related module processes.
• Experience working in CMOS, MEMS, photonics, photovoltaic, or heterogeneous integration / advanced packaging fabrication environments.
• Demonstrated experience leading structured problem-solving efforts using 8D, 3D, Fishbone, 5 Why, fault-tree analysis, or similar methodologies.
• Strong working knowledge of DOE, SPC, process capability analysis, and statistical methods, with the ability to teach and lead others in their application.
• Demonstrated ability to lead cross-functional teams, manage multiple technical priorities, and deliver results in a fast-paced manufacturing or development environment.
• Strong interpersonal skills with the ability to influence, coach, and develop engineers and technical staff.
• Excellent written and verbal communication skills.
• Demonstrated ability to meet commitments, manage multiple projects simultaneously, and shift priorities based on business needs.
• Passion for leading teams, developing people, and building strong engineering capability.

Preferred Qualifications

• Experience with dielectric, metal, or specialty film deposition processes including CVD, PECVD, PVD, ALD, evaporation, or related thin film technologies.
• Experience with plasma etch, wet etch, wet cleans, contamination control, electroplating, or plated film quality improvement.
• Experience supporting advanced materials, specialty semiconductor processes, or customer-specific process flows.
• Advanced degree in engineering, materials science, physics, or a related technical field.
• Experience supporting both process development and production sustaining environments.
• Experience supporting government, aerospace, defense, or other high-reliability customer programs.
• Experience with security-sensitive manufacturing environments.