Process Engineering Manager - Dry Etch

About Tower Semiconductor

Tower Semiconductor, the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for analog integrated circuits to more than 300 customers worldwide across growing markets such as communications, mobile, infrastructure, consumer, industrial, automotive, medical, and aerospace and defense, among others. Join Tower and become part of a dynamic organization with exceptionally talented and dedicated team members who work collaboratively to provide best-in-class technological solutions to our clients. If you enjoy working with others in a dynamic, fast‑paced environment and are looking for an opportunity to grow your career in this exciting industry, then Tower Semiconductor is the place to be.

Responsibilities

• Lead, manage, and mentor a team of process engineers and technicians within the dry etch area, fostering their professional growth and development.
• Take ownership of sustaining engineering, process control, and continuous process improvement initiatives, while driving capacity expansion, process development, and technology transfer efforts.
• Champion quality improvement and cost reduction activities to ensure operational excellence within the area.
• Collaborate closely with Operations, Equipment Engineering Support, Integration, and R&D teams to ensure the delivery of high-quality products that meet customer specifications on schedule.
• Engage with global counterparts to benchmark dry etch processes and drive continuous improvement across the company.

Skills

• Passionate about mentoring and developing process engineers and technicians.
• Able to set clear goals and expectations and provide regular feedback.
• Able to lead the following activities in the dry etch area:
  • Monitor and control dry etch processes.
  • Solve technical problems in the area to ensure predictable high quality, and participate in troubleshooting taskforces, as needed, to develop solutions that prevent recurrence.
  • Proactively identify continuous improvement and cost savings activities and drive them to completion.
  • Improve the flexibility of the area by qualifying additional processes on different toolsets.
  • Qualify new toolsets efficiently and effectively.
• Can partner with operations and equipment engineering support to resolve manufacturing challenges in order to meet output requirements.
• Able to act as a key technical resource, providing technical guidance and support to the team.
• Can establish process specifications for new technologies, characterize new processes and transition documented processes to production operations.
• Can justify, procure and implement into production new process tools to satisfy technology and capacity requirements.
• Can partner with global counterparts to identify and implement best practices.
• High sense of ownership and self‑motivated.
• Data‑driven, results oriented, and a team player able to foster a collaborative and high‑performance environment.
• Communicates effectively with team members at all levels of the organization.
• Can coach and mentor team members supporting their career development.
• Can lead teams and solve complex technical problems.
• Can assess and mitigate risks to enable sound, informed decision‑making on critical issues.
• Strong organizational skills; demonstrated ability to manage multiple tasks simultaneously and able to react to shifting priorities to meet business needs.
• Excellent interpersonal skills, energetic and self‑starter.
• Can meet deadlines and commitments.
• Outstanding communication skills, both written and verbal.
• Ability to work well within a global team or environment.

Requirements

• Technical knowledge of dry etch principles, theories, concepts, materials, applications, and techniques.
• 3+ years of leadership experience in a semiconductor fab, with a track record of managing and developing engineering teams.
• Expertise with AMAT, LAM, and/or TEL dry etch tools and processes.
• Knowledge of advanced CMOS and RF wafer processing technologies and processes and product level interactions that affect device yields.
• Proven success in leading teams and solving complex technical problems.
• Expertise in data analysis, problem‑solving, and technical troubleshooting.
• Experience with design of experiment techniques and data analysis.

Nice to Have

• Knowledge of PROMIS WIP management and JMP statistical analysis software are a plus.

Pay

$185,000 - $208,000