Process Engineer, Chemical and Mechanical Polish (CMP)

About the role

The Chemical and Mechanical Polish (CMP) Process Development Engineer supports the development of manufacturable, repeatable, and high-yielding processes for state-of-the-art devices in Aerospace, Defense, Bioelectronics, and High-Speed Communications. This role requires a hands-on mindset, strong communication skills, and an engineering degree (MS or PhD) in Electrical Engineering, Material Science, or Chemistry. The position offers a rare opportunity to develop semiconductor engineering skills within a high-performance technical team working on disruptive technologies.

The candidate will provide technical and sustaining engineering support in both development and manufacturing, recommend and implement process modifications to improve efficiencies and yields, and conduct statistical analyses such as Design of Experiments (DOE) and Statistical Process Control (SPC). The role involves close collaboration with Senior Process Development Engineers, Product Design, and Process Integration teams to ensure compatibility between processes and designs. The candidate will develop expertise in major CMP process modules, including Cu, Ta, W, Glass, SiO₂, Si, amorphous, and polyimide polish, as well as post-polish cleaning techniques.

Responsibilities

• Work closely with Senior Integration Engineers, customers, and other development engineers to execute experiments and optimize processes during 24/7 fab operations. Partner with Product Engineering and Integration to ensure effective new product introductions and consistent device performance.
• Assist Process Technicians with challenging process steps, analyze metrology results, and disposition lots based on data and pass/fail criteria. Report results to Integration and Process Development teams and provide effective pass-downs to sustain uninterrupted operations.
• Sustain and improve wafer fabrication processes by interfacing with equipment engineering, operations, and management to enhance cycle time, tool availability, quality, and yields. Maintain knowledge of applicable codes and standards for production equipment and ensure products conform to specifications.
• Communicate with Senior Development and Integration teams to resolve technical issues and sustain processes in dielectric CMP, Silicon/Amorphous Silicon CMP, Cu CMP, Ta CMP, W CMP, Polyimide CMP, and post-CMP cleaning techniques.
• Create and maintain operating specifications for production processes and equipment. Drive innovation and continuous improvement in a fast-paced environment.
• Monitor process health using Statistical Process Control (SPC) and respond to out-of-control events following established action plans.
• Work collaboratively with Skorpios’ Integration, Operations, Maintenance, and Development teams to execute project plans and meet company deliverables.
• Understand and protect both customer and Skorpios intellectual property while developing new IP.

Requirements

• Ph.D. or Master’s Degree in Electrical Engineering, Material Science, Physics, or Chemistry. Equivalent industry experience is also acceptable. Advanced degrees and development environment experience are preferred.
• Processing experience in a lab or fab environment, specifically in Chemical and Mechanical Polish and post-polish wafer surface cleaning. Experience with Cu plating is a plus.
• Willingness to work a flexible schedule in support of 24/7 manufacturing operations.
• Strong interpersonal and communication skills, with the ability to work with minimal supervision.

Skills

• Ability to collaborate effectively with junior and senior team members, including Process Technicians and Engineers.
• Basic understanding of algebraic concepts and semiconductor processing.
• Proficiency in MS Office (Word, Excel, PowerPoint) and strong data extraction, analysis, and reporting skills.
• Ability to troubleshoot problems and address root causes.
• Experience planning and prioritizing activities to meet goals and timelines in a dynamic start-up environment.
• Strong ownership and responsiveness in a manufacturing environment, with good data analysis and statistics skills.
• Flexibility to work hands-on in the cleanroom, operate tools, write and run CMP recipes, inspect wafers under a microscope, and perform basic characterization related to CMP processing (particles/defects metrology, roughness metrology, thickness/uniformity metrology).
• Understanding of maintenance activities required to ensure a healthy and repeatable process.

Physical Requirements

• Successful completion of a post-offer pre-employment background check.
• Sedentary work involving sitting, standing, and walking; occasional carrying, pushing, or pulling of items in excess of 10 pounds.
• Daily use of computers, copy machines, telephones, and general office equipment.
• Work in a cleanroom environment, including wearing cleanroom gowns and using metrology or characterization equipment.

Other Requirements

This position is subject to International Traffic in Arms Regulations (ITAR). All applicants must be U.S. persons (U.S. Citizen, U.S. Permanent Resident, Political Asylee, or Refugee). Visa sponsorship is not available. Ability to travel less than 5%.

Benefits

• Competitive salary.
• Medical, dental, and vision coverage.
• 401(k) savings plan.
• Company-paid life insurance and disability.
• Paid holidays and vacation.
• Gym membership discounts.

Pay

Expected salary range: $100,000 – $140,000, depending on education, qualifications, and experience. The actual starting rate will be determined based on role-related criteria, including educational qualifications, relevant work history, and required skills.