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Principal Hardware Engineer (Teradyne, Oregon)

Teradyne · Tualatin, OR · 3 wk ago
Engineering$175k–$281k/yrFull-time

About the role

The Senior Hardware Engineer in the hardware group is responsible for designing, developing, and validating high-current, high-power sourcing and switching hardware used in semiconductor automated test equipment. This role focuses on power delivery architecture, fast transient response, load regulation, protection systems, thermal management, and system-level integration to support advanced SoCs, FPGAs, high-power devices, and complex test conditions.

Responsibilities

  • Architect and design high-current power delivery modules (from mA to 100+ A) for ATE systems.

  • Develop fast-response voltage/current sourcing circuits optimized for dynamic load conditions, droop control, and transient performance.

  • Implement advanced power-stage topologies (buck, multiphase, linear, hybrid) tailored for semiconductor test environments.

  • Design for wide operating ranges, including high-voltage rails, low-voltage/high-current rails, and dynamic voltage scaling.

  • Optimize power integrity across the full PDN (instrumentation → cabling → loadboard → DUT).

  • Model and mitigate droop, overshoot, ringing, and ground bounce under fast load steps.

  • Perform simulation and analysis of loop stability, compensation networks, and transient response.

  • Ensure compliance with DUT power-up sequencing, ramp rates, and timing constraints.

  • Design robust protection systems including OCP, OVP, OTP, short-circuit protection, and fault-isolation mechanisms.

  • Implement fast fault-response circuits to protect sensitive DUTs and ATE hardware.

  • Conduct reliability analysis, derating studies, and thermal modeling for long-term stability.

  • Support HALT/HASS, stress testing, and failure-mode investigations.

  • Develop efficient high-current solutions for routing power to multiple DUT pins or sites.

  • Engineer low-impedance, low-loss paths for high-current delivery with attention to thermal and mechanical constraints.

  • Collaborate with mechanical teams on heatsinking, airflow, and thermal interface design.

  • Lead bring-up of new power-delivery modules, performing root-cause analysis of analog, digital, and mixed-signal issues.

  • Execute characterization plans for load regulation, transient response, efficiency, thermal behavior, and fault handling.

  • Use advanced lab equipment (power analyzers, high-bandwidth scopes, current probes, electronic loads) to validate performance.

  • Ensure power-delivery modules meet ATE system-level requirements for timing, triggering, synchronization, and software control.

  • Collaborate with firmware teams on control loops, telemetry, calibration, and fault-reporting algorithms.

  • Create and use ATE test programs to validate instrument and system level designs.

  • Support integration with loadboards, probecards, and DUT power-delivery networks.

  • Work with product engineering, test engineering, and silicon teams to define power-delivery requirements for new devices.

  • Provide technical mentorship and contribute to power-delivery design standards and best practices.

Requirements

  • 12+ years of experience in power electronics, high-current power delivery, or instrumentation hardware design.

  • Strong expertise in switching power supplies, multiphase regulators, linear regulators, and power-stage design.

  • Experience with power integrity, transient analysis, and compensation/stability design.

  • Proficiency with SPICE simulation, PDN modeling tools, and PCB design tools.

  • Hands-on experience with power measurement equipment and high-current test setups.

  • Strong analytical and debugging skills.

  • Experience designing power-delivery modules for ATE instrumentation.

  • Knowledge of dynamic voltage scaling, digital power control, and telemetry systems.

  • Familiarity with high-current connectors, cabling, and low-impedance mechanical design.

  • Understanding of thermal modeling, heatsink design, and system-level thermal constraints.

Qualifications

  • Bachelor’s or Master’s degree in Electrical Engineering or related field.

Skills

  • Power electronics

  • High-current power delivery

  • Instrumentation hardware design

  • Power integrity

  • Transient analysis

  • Compensation/stability design

  • SPICE simulation

  • PDN modeling tools

  • PCB design tools

  • Power measurement equipment

  • High-current connectors

  • Cabling

  • Thermal modeling

  • Heatsink design

Benefits

  • Medical

  • Dental

  • Vision

  • Flexible Spending Accounts

  • Retail Savings Plans

  • Life and Disability Insurance

  • Paid Vacation & Holidays

  • Tuition Assistance Programs

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