PC Board Assembly Manufacturing Engineering Manager

About the role

Johnson Outdoors Marine Electronics, Inc. is seeking a PC Board Assembly Manufacturing Engineering Manager.

Responsibilities

• Design and implement electronic manufacturing systems.
• Oversee the development and implementation of technology, equipment, and processes to manufacture printed circuit board assemblies (“PCBAs”).
• Utilizing process engineering to optimize paste printing, surface mount technology, reflow soldering, selective / wave soldering, through-hole insertion, and IPC standards and statistical techniques.
• Analyze and optimize manufacturing equipment performance and track key performance indicators (KPIs) to maximize productivity and reduce downtime.
• Drive continuous improvement efforts in manufacturing processes and identify inefficiencies, bottlenecks, and areas for improvement to enhance productivity and quality.
• Oversee the planning, design, and execution of engineering projects aimed at upgrading facilities, equipment, and processes to improve manufacturing capacity and reduce operational costs.
• Conduct Design for Manufacturability (DFM) and risk assessments for new product introductions and process changes.
• Implement and monitor quality control measures and ensure products comply with DFM guidelines, industry standards, and customer requirements.
• Conduct daily process audits to maintain control over the manufacturing process.
• Create and update standard operating procedures (SOPs), work instructions, and training materials.
• Stay up to date on advancements in mechanical and electrical manufacturing technologies.
• Utilize SPC, TQM, Six Sigma, and Lean methodologies for process improvement and scrap reduction.
• Manage direct reports.

Requirements

• Requires Bachelor’s degree in Electronic Engineering, Electrical Engineering, Manufacturing Engineering, or a related field plus five years of progressive experience in electronic manufacturing systems.
• Must have at least five years of experience in each of the following:
• Overseeing the development and implementation of technology, equipment, and processes to manufacture printed circuit board assemblies (“PCBAs”);
• Utilizing process engineering to optimize paste printing, surface mount technology, reflow soldering, selective / wave soldering, through-hole insertion, and IPC standards and statistical techniques;
• Analyzing and optimizing manufacturing equipment performance and tracking key performance indicators (KPIs);
• Conducting Design for Manufacturability (DFM) and risk assessments for new product introductions and process changes;
• Implementing and monitoring quality control measures and ensuring that products comply with DFM guidelines, industry standards, and customer requirements;
• Performing process optimization using DFM and PFMEA methodologies;
• Utilizing SPC, TQM, Six Sigma, and Lean methodologies for process improvement and scrap reduction.