Packaging Module Engineer

About the Role

As a Packaging Module Engineer, you will play a pivotal role in shaping Intel's advanced packaging solutions that directly impact the delivery, performance, and sustainability of cutting-edge products. By applying scientific and engineering principles, you will design and develop innovative packaging solutions that ensure the secure transportation and optimal performance of Intel's products globally. This role empowers you to influence manufacturing processes, enhance efficiency, and support Intel's growth in the competitive semiconductor industry while collaborating with industry-leading teams on groundbreaking projects.

Responsibilities

• Design, develop, and qualify packaging solutions and materials that meet product and regulatory requirements.
• Lead packaging development processes, including artwork creation, concepts, prototypes, qualification testing, and specification documentation.
• Collaborate with manufacturing, logistics, regulatory, and supply chain partners to ensure packaging solutions meet operational needs.
• Identify and implement cost-saving, waste-reduction, and efficiency improvement measures for packaging processes.
• Conduct risk analysis to ensure packaging solutions comply with regulations and align with Intel's quality standards.
• Consult with cross-organizational teams on branding, marketing, SKUs, labeling, and bills of material requirements for shipments into Intel's distribution channel.
• Evaluate and qualify vendors to ensure high-quality packaging manufacturing startup and scalability.
• Benchmark packaging designs and processes against industry standards to maintain a competitive edge.
• Document and maintain technical specifications for packaging solutions to ensure consistency and clarity.

Qualifications

Minimum Qualifications:

• Possess a Master's degree in Engineering, Physics, Chemistry, or a related STEM field with 1+ years of educational or work experience.
• Or a PhD degree in the same fields with 6+ months of educational or work experience.
• Experience in product packaging assembly processes and production methodologies.
• Knowledge of statistical process control (SPC) principles and design of experiments (DOE) techniques.
• Analytical skills with proficiency in data analysis and risk assessment methods.
• Experience with design for manufacturing (DFM) practices and packaging test criteria.

Preferred Qualifications:

• Experience with Surface Mount Technologies, solder joint formation/quality/reliability, and package certification methodologies.
• Experience leading technical teams, influencing stakeholders, and managing resources and timelines in a matrixed environment.
• Familiarity with semiconductor device fabrication processes and packaging process flows.
• A track record of delivering results in time-critical technical projects involving innovation and strategic planning.
• Ability to apply problem-solving techniques and fundamental engineering concepts to create novel, efficient solutions.

Skills

• Demonstrated problem-solving skills in packaging development or manufacturing.
• Effective communication skills to collaborate with cross-organizational teams and external vendors and customers.
• Passion for engineering excellence and sustainability.

Benefits

Intel offers a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Pay

Annual Salary Range for jobs which could be performed in the US: $99,030.00 - $188,890.00 USD. The range reflects the minimum and maximum target compensation for the position across all US locations. Individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Schedule

This role requires an on-site presence on Shift 1 (United States of America).

Primary Location: US, Arizona, Phoenix.