Packaging Module Development Engineer

Intel’s Advanced Packaging Technology Manufacturing (APTM) division develops and commercializes industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.

About the role

• Develop thermal interface technology and material solutions to support Intel's future packaging platforms.
• Collaborate with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Innovate next-generation materials, equipment, and fabrication processes to enhance semiconductor packaging capabilities at scale.
• Manage projects to meet product development timelines.
• Apply formal education and judgment to solve technical problems.
• Provide sustaining support for equipment performance and process health in high-volume manufacturing.
• Respond promptly to foundry customer requests and events.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are considered a plus factor in identifying top candidates.

• Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, Chemical Engineering, or a related STEM field with 1+ years of relevant experience OR PhD in the same fields.
• Minimum GPA of 3.5.
• At least one publication in a peer-reviewed technical journal.

Skills

The ideal candidate will demonstrate:

• Technical leadership, strategic planning, and critical thinking.
• Ability to coach and develop technical teams.
• Tolerance for ambiguity and adaptability in a dynamic environment.
• Flexibility in managing changing priorities and responsibilities.
• Experience leading teams in a highly matrixed organization.
• Initiative and ability to work independently.
• Strong communication, influencing, technical, and analytical skills.

Preferred Qualifications

• One or more years of experience delivering results for complex, time-critical technical projects.
• Experience with semiconductor fabrication processes and technology.
• Familiarity with technology development, including Statistical Process Control (SPC) and/or Design of Experiments (DOE).
• Previous related work experience in a semiconductor foundry.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Pay

Annual Salary Range for jobs which could be performed in the US: $99,030.00 - $188,890.00 USD. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Schedule

• This role requires an on-site presence.
• Shift 1 (United States of America).