Packaging module development engineer

Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role, you will develop and optimize cutting-edge substrate processes and equipment to enable Intel's future packaging platform technologies. Your contributions will directly impact the manufacturability and reliability of next-generation products, addressing quality, cost, yield, and productivity requirements.

About the role

Collaborate with cross-functional teams to tackle complex challenges, push boundaries, and innovate within a dynamic, fast-paced environment. The scope of this role includes:

• Process equipment design, install, and qualification
• Technology pathfinding and development of multi-metal plating module focusing on surface prep processes, electroless and electrolytic plating

The engineer will join a world-class, first-of-a-kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry.

Responsibilities

• Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies
• Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process/equipment/materials/chemistry interactions
• Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity
• Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development

Requirements

You must possess the below requirements to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

• Bachelor’s degree in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Engineering, Mechanical Engineering, Construction Management, or related engineering degree plus 2+ years of experience
• Master's degree in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Engineering, Mechanical Engineering, Construction Management, or related engineering degree
• Experience in packaging module development, process equipment design, install, and qualification
• Experience defining and establishing equipment configurations, process specifications, and integrated process flow for new process technologies

Preferred Qualifications

• Plating chemistry and electrochemistry fundamental knowledge
• PhD degree in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Engineering, Mechanical Engineering, or related engineering degree
• Experience planning and conducting comprehensive DOEs to fundamentally characterize process window, and understand process/equipment/materials/chemistry interactions
• Experience driving continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity

Behavioral Traits

• Proven technical leadership skills: self-initiative, leadership, action-oriented by influencing, written and verbal communication skills with the ability to work independently
• Demonstrated ability to successfully participate in a highly matrixed environment managing resources and timelines, as well as proven stakeholder management
• Flexibility in changing priorities and responsibilities to support business needs
• Ability to work with ambiguity in a fast-paced, constantly changing product roadmap environment

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Pay

Annual Salary Range for jobs which could be performed in the US: $99,030.00 - $188,890.00 USD. The range displayed reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Schedule

This role requires an on-site presence on Shift 1 (United States of America). Primary location: US, Arizona, Phoenix.