Package Development, Signal Integrity and Power Integrity Engineer, Principal

About the Role

Marvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances.

The engineer will interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements. Additionally, the engineer will work with marketing and IC designers to develop achievable package specs and contribute to new package technology development.

Requirements

• Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5 - 8 years of related professional experience or Master’s/PhD in Computer Science, Electrical Engineering or related fields with 1-3 years of experience.
• Strong fundamentals in EM, transmission lines, and microwave theory.
• Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity.
• Ability to manage package development involving cross-functional teams like assembly development, IC physical layout teams, Analog and Digital designers, and marketing.
• Familiarity with IC package layout tools like APD or PADS.
• Familiarity with Co-Packaged Optics and Optics packaging is a plus.
• Experience with 2.5D/3D package development is highly desired.
• Ability to automate SI, PI, and Packaging activities using scripting tools like Python.
• Working knowledge of circuit design tools: Spectre, ADS, HSpice.
• Experience with VNA and TDR measurements for package and PCB characterization.
• Frequency domain and time domain knowledge of high-speed signaling.
• Experience with high-speed electronic packaging for digital and analog ICs.
• Power plane design, modeling, and analysis using tools like PowerSI, SIwave.
• Familiarity with packaging technologies, materials, package substrate design rules, and assembly rules.
• Understanding, debugging, and simulations of EMI/EMC problems.
• Track record of new product introduction from concept, through development, and production is a plus.
• Knowledge of thermal and mechanical analysis of IC package development is a plus.
• Experience with channel simulations using MATLAB, ADS, or other tools is a plus.
• Strong communication, presentation, and documentation skills.
• A team player.

Pay

Expected Base Pay Range (USD): $168,400 - $249,310 per annum. The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions.

Benefits

Marvell is committed to providing exceptional, comprehensive benefits that support employees at every stage—from internship to retirement and through life’s most important moments. Offerings include:

• Employee stock purchase plan with a 2-year look back.
• Family support programs to help balance work and home life.
• Robust mental health resources to prioritize emotional well-being.
• Recognition and service awards to celebrate contributions and milestones.