Package Development, Signal Integrity and Power Integrity Engineer, Senior Staff

About the Role

Marvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects. The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements. The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.

Requirements

• At least a Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5-10 years of related professional experience OR a Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3-5 years of experience.
• Strong fundamentals in EM, transmission lines and microwave theory.
• Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity.
• Frequency domain and time domain knowledge of high speed signaling.
• Ability to automate the SI, PI and Packaging activities using scripting tools like Python.
• Experience with high-speed electronic packaging for digital and analog ICs.
• Power plane design, modeling and analysis using tools like PowerSI, SIwave.
• Working knowledge of circuit design tools: Spectre, ADS, HSpice.
• Understanding, debugging and simulations of EMI/EMC problems.
• Familiarity with packaging technologies, materials, package substrate design rules and assembly rules.
• Ability to manage package development involving various cross functional teams like assembly development, IC physical layout teams, Analog and Digital designers, marketing.
• Familiarity with IC package layout tools like APD or PADS.
• Experience with 2.5D/3D package development is highly desired.
• Experience with CPC/CPO connectors is highly desired.
• Experience with channel simulations using MATLAB or ADS or other tools is a plus.
• Track record of new product introduction from concept, through development and production is a plus.
• Knowledge of the thermal and mechanical analysis of the IC package development is a plus.
• Strong communication, presentation, and documentation skills.
• A team player.

Pay

Expected Base Pay Range (USD): $142,700 - $211,230 per annum. The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions.

Benefits

Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage—from internship to retirement and through life’s most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include:

• Employee stock purchase plan with a 2-year look back.
• Family support programs to help balance work and home life.
• Robust mental health resources to prioritize emotional well-being.
• Recognition and service awards to celebrate contributions and milestones.